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器件3D模型￥ 75.135
TMS320C5515AZCH12 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DSP数字信号处理器
封装:
NFBGA-196
描述:
DSP)，Texas Instruments德州仪器数字信号处理器是微处理器，带有一个优化的体系结构，用于数字信号处理的运算需求。### 数字信号处理器，Texas Instruments
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P15P62P65Hot
典型应用电路图在P138
原理图在P4
封装尺寸在P157
封装信息在P156P157P158
功能描述在P61
技术参数、封装参数在P12P71P76P77P78P79P80P81P82P83P84P85
应用领域在P1P160
电气规格在P12P38P42P69P73P74P75P76P77P78P79P80
导航目录
TMS320C5515AZCH12数据手册
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Mar-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TMS320C5515AZCH10 ACTIVE NFBGA ZCH 196 184 Green (RoHS
& no Sb/Br)
Call TI Level-3-260C-168 HR
TMS320C5515AZCH12 ACTIVE NFBGA ZCH 196 184 Green (RoHS
& no Sb/Br)
SNAGCU Level-3-260C-168 HR
TMS320C5515AZCHA10 ACTIVE NFBGA ZCH 196 184 Green (RoHS
& no Sb/Br)
Call TI Level-3-260C-168 HR
TMS320C5515AZCHA12 ACTIVE NFBGA ZCH 196 184 Green (RoHS
& no Sb/Br)
Call TI Level-3-260C-168 HR
TMX320C5515AZCH12 ACTIVE NFBGA ZCH 196 184 Green (RoHS
& no Sb/Br)
SNAGCU Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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