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器件3D模型￥ 2.516
TMS320F28032PAGS 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
微控制器
封装:
TQFP-64
描述:
Piccolo微处理器 Piccolo Microcontrollers
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P9P78Hot
典型应用电路图在P48P94
原理图在P3P76P91P96P105P108P110P124P126P129
封装尺寸在P156P157P158
标记信息在P156P157P158P159
封装信息在P2P150P156P157P158P159
技术参数、封装参数在P21P22P23P24P25P26P27P28P29P30P31P32
应用领域在P1P67P123P127P144
电气规格在P27P45P64P83P92
型号编号列表在P110
导航目录
TMS320F28032PAGS数据手册
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4
TMS320F28030
,
TMS320F28031
,
TMS320F28032
TMS320F28033
,
TMS320F28034
,
TMS320F28035
SPRS584K –APRIL 2009–REVISED JUNE 2016
www.ti.com
Submit Documentation Feedback
Product Folder Links: TMS320F28030 TMS320F28031 TMS320F28032 TMS320F28033 TMS320F28034
TMS320F28035
Table of Contents Copyright © 2009–2016, Texas Instruments Incorporated
Table of Contents
1 Device Overview ......................................... 1
1.1 Features .............................................. 1
1.2 Applications........................................... 1
1.3 Description............................................ 2
1.4 Functional Block Diagram ........................... 3
2 Revision History ......................................... 5
3 Device Comparison ..................................... 6
3.1 Related Products ..................................... 8
4 Terminal Configuration and Functions.............. 9
4.1 Pin Diagrams ......................................... 9
4.2 Signal Descriptions.................................. 13
5 Specifications........................................... 21
5.1 Absolute Maximum Ratings ........................ 21
5.2 ESD Ratings ........................................ 21
5.3 Recommended Operating Conditions............... 22
5.4 Power Consumption Summary...................... 23
5.5 Electrical Characteristics............................ 27
5.6 Thermal Resistance Characteristics ................ 28
5.7 Thermal Design Considerations .................... 30
5.8 Emulator Connection Without Signal Buffering for
the MCU............................................. 30
5.9 Parameter Information .............................. 31
5.10 Test Load Circuit ................................... 31
5.11 Power Sequencing .................................. 32
5.12 Clock Specifications................................. 35
5.13 Flash Timing ........................................ 38
6 Detailed Description ................................... 40
6.1 Overview ............................................ 40
6.2 Memory Maps ...................................... 49
6.3 Register Maps....................................... 56
6.4 Device Emulation Registers......................... 58
6.5 VREG/BOR/POR.................................... 59
6.6 System Control...................................... 61
6.7 Low-power Modes Block............................ 69
6.8 Interrupts ............................................ 70
6.9 Peripherals .......................................... 75
7 Applications, Implementation, and Layout ...... 144
7.1 TI Design or Reference Design.................... 144
8 Device and Documentation Support.............. 145
8.1 Getting Started..................................... 145
8.2 Device and Development Support Tool
Nomenclature ...................................... 145
8.3 Tools and Software ................................ 146
8.4 Documentation Support............................ 147
8.5 Related Links ...................................... 148
8.6 Community Resources............................. 149
8.7 Trademarks ........................................ 149
8.8 Electrostatic Discharge Caution ................... 149
8.9 Glossary............................................ 149
9 Mechanical Packaging and Orderable
Information............................................. 150
9.1 Packaging Information ............................. 150
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