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TPA2006D1EVM 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
开发套件
描述:
TEXAS INSTRUMENTS TPA2006D1EVM 评估模块, TPA2006D1
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P19
原理图在P11P16P17P18P19P22
封装尺寸在P25P27P28
标记信息在P25
封装信息在P24P25P26P27P28
技术参数、封装参数在P4P10
应用领域在P1P32
电气规格在P5
导航目录
TPA2006D1EVM数据手册
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TPA2006D1
SLOS498B –SEPTEMBER 2006–REVISED SEPTEMBER 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
In active mode –0.3 6 V
V
DD
Supply voltage
In SHUTDOWN mode –0.3 7 V
V
I
Input voltage –0.3 V
DD
+ 0.3 Ω
2.5 ≤ V
DD
≤ 4.2 V 3.2
R
L
Load resistance Ω
4.2 < V
DD
≤ 6 V 6.4
T
A
Operating free-air temperature –40 85 ° C
T
J
Operating junction temperature –40 150 °C
T
stg
Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
Electrostatic
V
(ESD)
V
discharge
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
DD
Supply voltage 2.5 5.5 V
V
IH
High-level input voltage SHUTDOWN 1.3 V
DD
V
V
IL
Low-level input voltage SHUTDOWN 0 0.35 V
R
I
Input resistor Gain ≤ 20 V/V (26 dB) 15 kΩ
V
IC
Common mode input voltage range V
DD
= 2.5 V, 5.5 V, CMRR ≤ –49 dB 0.5 V
DD
–0.8 V
T
A
Operating free-air temperature –40 85 °C
7.4 Thermal Information
TPA2006D1
THERMAL METRIC
(1)
VSON (DRB) UNIT
8 PINS
R
θJA
Junction-to-ambient thermal resistance 50.9 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 66.2 °C/W
R
θJB
Junction-to-board thermal resistance 25.9 °C/W
ψ
JT
Junction-to-top characterization parameter 1.4 °C/W
ψ
JB
Junction-to-board characterization parameter 26 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TPA2006D1
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