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TPA321D 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
音频放大器
封装:
SOIC-8
描述:
TEXAS INSTRUMENTS TPA321D 音频功率放大器, AB, 1通道, 700 mW, 2.5V 至 5.5V, SOIC, 8 引脚
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TPA321D数据手册
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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATING TABLE
RECOMMENDED OPERATING CONDITIONS
TPA321
SLOS312C – JUNE 2000 – REVISED JUNE 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
AVAILABLE OPTIONS
PACKAGED DEVICES
MSOP
T
A
SYMBOLIZATION
SMALL OUTLINE
(1)
(D) MSOP
(1)
(DGN)
–40°C to 85°C TPA321D TPA321DGN AJB
(1) The D and DGN packages are available taped and reeled. To order a taped and reeled part, add the
suffix R to the part number (e.g., TPA321DR).
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
V
DD
Supply voltage 6 V
V
I
Input voltage –0.3 V to V
DD
+0.3 V
Continuous total power dissipation Internally limited (see Dissipation Rating Table)
T
A
Operating free-air temperature range –40°C to 85°C
T
J
Operating junction temperature range –40°C to 150°C
T
stg
Storage temperature range –65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE T
A
≤ 25°C DERATING FACTOR T
A
= 70°C T
A
= 85°C
D 725 mW 5.8 mW/°C 464 mW 377 mW
DGN 2.14 W
(1)
17.1 mW/°C 1.37 W 1.11 W
(1) See the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report
(literature number SLMA002), for more information on the PowerPAD™ package. The thermal data
was measured on a PCB layout based on the information in the section entitled Texas Instruments
Recommended Board for PowerPAD on page 33 of the before mentioned document.
MIN MAX UNIT
V
DD
Supply voltage 2.5 5.5 V
V
IH
High-level voltage SHUTDOWN 0.9 V
DD
V
V
IL
Low-level voltage SHUTDOWN 0.1 V
DD
V
T
A
Operating free-air temperature –40 85 °C
2
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