Datasheet 搜索 > 音频放大器 > TI（德州仪器） > TPA711D 数据手册 > TPA711D 数据手册 1/39 页
器件3D模型￥ 9.263
TPA711D 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
音频放大器
封装:
SOIC-8
描述:
Texas InstrumentsTexas Instruments 一系列单通道功率放大器 IC 具有低于 1W 到高于 50W 的功率输出。 这些高度集成设备包含很多高级功能，包括热过载、短路和安全工作区域保护、静音设施和宽工作电压范围。### 音频放大器，Texas Instruments
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TPA711D数据手册
Page:
of 39 Go
若手册格式错乱，请下载阅览PDF原文件
SLOS230D − NOVEMBER 1998 − REVISED OCTOBER 2002
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D Fully Specified for 3.3-V and 5-V Operation
D Wide Power Supply Compatibility
2.5 V − 5.5 V
D Output Power
− 700 mW at V
DD
= 5 V, BTL, R
L
= 8 Ω
− 85 mW at V
DD
= 5 V, SE, R
L
= 32 Ω
− 250 mW at V
DD
= 3.3 V, BTL, R
L
= 8 Ω
− 37 mW at V
DD
= 3.3 V, SE, R
L
= 32 Ω
D Shutdown Control
− I
DD
= 7 µA at 3.3 V
− I
DD
= 50 µA at 5 V
D BTL to SE Mode Control
D Integrated Depop Circuitry
D Thermal and Short-Circuit Protection
D Surface-Mount Packaging
− SOIC
− PowerPAD MSOP
description
The TPA711 is a bridge-tied load (BTL) or
single-ended (SE) audio power amplifier devel-
oped especially for low-voltage applications where internal speakers and external earphone operation are
required. Operating with a 3.3-V supply, the TPA711 can deliver 250-mW of continuous power into a BTL 8-Ω
load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out
to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL
configuration eliminates the need for external coupling capacitors on the output in most applications, which is
particularly important for small battery-powered equipment. A unique feature of the TPA711 is that it allows the
amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated
mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode
for power-sensitive applications with special depop circuitry to eliminate speaker noise when exiting shutdown
mode. The TPA711 is available in an 8-pin SOIC and the surface-mount PowerPAD MSOP package, which
reduces board space by 50% and height by 40%.
Audio
Input
Bias
Control
V
DD
700 mW
6
5
7
V
O
+
V
DD
3
1
2
4
BYPASS
IN
SE/BTL
V
DD
/2
C
I
R
I
C
S
C
B
R
F
SHUTDOWN
From HP Jack
V
O
−8
GND
From System Control
−
+
−
+
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2002, Texas Instruments Incorporated
!" #!$% &"'
&! #" #" (" " ") !"
&& *+' &! #", &" ""%+ %!&"
", %% #""'
1
2
3
4
8
7
6
5
SHUTDOWN
BYPASS
SE/BTL
IN
V
O
−
GND
V
DD
V
O
+
D OR DGN PACKAGE
(TOP VIEW)
PowerPAD is a trademark of Texas Instruments.
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