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TPD1E05U06
,
TPD4E05U06
,
TPD6E05U06
www.ti.com
SLVSBO7I DECEMBER 2012REVISED JULY 2015
7 Specifications
7.1 Absolute Maximum Ratings
(1)(2)(3)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Operating Temperature -40 125 °C
Electrical Fast
IEC 61000-4-4 (5/50 ns) 80 A
Transient
IEC 61000-4-5 Current (tp 8/20 µs)
(4)
2.5 A
Peak Pulse
IEC 61000-4-5 Power (tp 8/20 µs)
(4)
40 W
T
stg
Storage temperature range –65 155 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability.
(2) Absolute maximum ratings apply over recommended junction temperature range.
(3) Voltages are with respect to GND unless otherwise noted.
(4) Measured at 25°C.
7.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±4000
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1500
Electrostatic
V
(ESD)
V
discharge
Contact ±12000
61000-4-2 ESD ratings
Air ±15000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±4000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±1500 V may actually have higher performance.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
IO
Input pin voltage 0 5.5 V
T
A
Operating free-air temperature –40 125 °C
7.4 Thermal Information
TPD1E05U06 TPD4E05U06 TPD6E05U06
THERMAL METRIC
(1)
DPY (X2SON) DQA (USON) RVZ (USON) UNIT
2 PINS 10 PINS 14 PINS
R
θJA
Junction-to-ambient thermal resistance 697.3 327 197.9 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 471 189.5 119.1 °C/W
R
θJB
Junction-to-board thermal resistance 575.9 257.7 92.6 °C/W
ψ
JT
Junction-to-top characterization parameter 175.7 60.9 22 °C/W
ψ
JB
Junction-to-board characterization parameter 575.1 257 91.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 5
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