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器件3D模型￥ 4.576
TPS3510P 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
电源监控芯片
封装:
PDIP-8
描述:
MPU 监控和重置电路，Texas Instruments，双/多/可调Texas Instruments 微处理器电源电压监控和重置电路，具有双、多和可调阈值级别。### 微处理器电源电压监控和复位电路电源电压监测和监控电路，用于台式机、便携式计算机和笔记本电脑、测试和测量仪器、便携式电池供电设备和多输出电源。电源电压探测器 电源电压监控器 电源监控器 微处理器监控 微处理器电压监控器 微控制器复位电路
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P11P13P14
标记信息在P11P12
封装信息在P11P12P13P14
应用领域在P18
导航目录
TPS3510P数据手册
Page:
of 18 Go
若手册格式错乱，请下载阅览PDF原文件
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TPS3510D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PS3510
TPS3510DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PS3510
TPS3510DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PS3510
TPS3510DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PS3510
TPS3510P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 85 TPS3510P
TPS3510PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 85 TPS3510P
TPS3511D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 PS3511
TPS3511DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 PS3511
TPS3511DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 PS3511
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
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