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TPS54308DDCR 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
封装:
TSOT-23-6
描述:
TPS54308DDCR 编带
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TPS54308DDCR数据手册
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4
TPS54308
SLUSCV2 –JUNE 2017
www.ti.com
Product Folder Links: TPS54308
Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Input voltage range, V
I
VIN –0.3 30 V
EN –0.3 7 V
FB –0.3 7 V
Output voltage range, V
O
BOOT-SW –0.3 7 V
SW –0.3 30 V
SW (20 ns transient) –5 30 V
Operating junction temperature, T
J
–40 150 °C
Storage temperature range, T
stg
–65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±4000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1500
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
I
Input voltage range
VIN 4.5 28 V
EN –0.1 7 V
FB –0.1 7 V
V
O
Output voltage range
BOOT-SW –0.1 7 V
SW –0.1 28 V
T
J
Operating junction temperature –40 125 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC
(1)
TPS54308
UNITDDC (SOT-23)
6 PINS
R
θJA
Junction-to-ambient thermal resistance 87.1 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 35.5 °C/W
R
θJB
Junction-to-board thermal resistance 14.4 °C/W
ψ
JT
Junction-to-top characterization parameter 0.9 °C/W
ψ
JB
Junction-to-board characterization parameter 14.2 °C/W
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