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TPS62175DQCR 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DC/DC转换器
封装:
WFDFN-10
描述:
TEXAS INSTRUMENTS TPS62175DQCR 直流-直流开关降压, 逐步递降稳压器, 可调, 4.75V-28V输入, 1V-6V/500mA输出, 1MHz, WSON-10 新
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引脚图在P3Hot
典型应用电路图在P1P13
原理图在P1P8P9
封装尺寸在P34P36P37
标记信息在P3P34
封装信息在P30P34P35P36P37
技术参数、封装参数在P4
应用领域在P1P38
电气规格在P5P6
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TPS62175DQCR数据手册
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TPS62175
,
TPS62177
SLVSB35C –OCTOBER 2012–REVISED JULY 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
VIN –0.3 30
Pin voltage
(2)
EN, SW –0.3 V
IN
+ 0.3 V
FB, PG, VOS, SLEEP, NC –0.3 7
Power good sink PG
10 mA
current
Operating junction temperature, T
J
–40 125
Temperature °C
Storage temperature, T
stg
–65 150
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to network ground terminal.
7.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
±2000
V
(ESD)
Electrostatic discharge V
Charged device model (CDM), per JEDEC specification JESD22-C101, all
±500
pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN NOM MAX UNIT
Supply voltage, V
IN
4.75 28 V
Operating free air temperature, T
A
–40 85 °C
Operating junction temperature, T
J
–40 125 °C
7.4 Thermal Information
TPS6217x
THERMAL METRIC
(1)
DQC [WSON] UNIT
10 PINS
R
θJA
Junction-to-ambient thermal resistance 61.6 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 65.5 °C/W
R
θJB
Junction-to-board thermal resistance 22.5 °C/W
ψ
JT
Junction-to-top characterization parameter 1.4 °C/W
ψ
JB
Junction-to-board characterization parameter 22.4 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 5.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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