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TPS659109 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
封装:
VQFN-48
描述:
集成的电源管理单元顶部规范 Integrated Power Management Unit Top Specification
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TPS659109数据手册
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TPS65910, TPS65910A, TPS65910A3, TPS659101, TPS659102, TPS659103
TPS659104, TPS659105, TPS659106, TPS659107, TPS659108, TPS659109
www.ti.com
SWCS046M –MARCH 2010–REVISED MARCH 2012
Integrated Power Management Unit Top Specification
Check for
Samples: TPS65910, TPS65910A, TPS65910A3, TPS659101, TPS659102, TPS659103, TPS659104, TPS659105, TPS659106,
TPS659107, TPS659108, TPS659109
1
FEATURES
APPLICATIONS
The purpose of the TPS65910 device is to
• Portable and handheld systems
provide the following resources:
• OMAP3 power management
• Embedded power controller
DESCRIPTION
• Two efficient step-down dc-dc converters for
The TPS65910 is an integrated power-management
processor cores
IC available in 48-QFN package and dedicated to
• One efficient step-down dc-dc converter for I/O
applications powered by one Li-Ion or Li-Ion polymer
power
battery cell or 3-series Ni-MH cells, or by a 5-V input;
• One efficient step-up 5-V dc-dc converter
it requires multiple power rails. The device provides
three step-down converters, one step-up converter,
• SmartReflex™ compliant dynamic voltage
and eight LDOs and is designed to support the
management for processor cores
specific power requirements of OMAP-based
• 8 LDO voltage regulators and one RTC LDO
applications.
(internal purpose)
Two of the step-down converters provide power for
• One high-speed I
2
C interface for general-
dual processor cores and are controllable by a
purpose control commands (CTL-I
2
C)
dedicated class-3 SmartReflex interface for optimum
• One high-speed I
2
C interface for SmartReflex
power savings. The third converter provides power for
Class 3 control and command (SR-I
2
C)
the I/Os and memory in the system.
• Two enable signals multiplexed with SR-I
2
C,
The device includes eight general-purpose LDOs
configurable to control any supply state and
providing a wide range of voltage and current
processor cores supply voltage
capabilities; they are fully controllable by the I
2
C
interface. The use of the LDOs is flexible; they are
• Thermal shutdown protection and hot-die
intended to be used as follows: Two LDOs are
detection
designated to power the PLL and video DAC supply
• A real-time clock (RTC) resource with:
rails on the OMAP based processors, four general-
– Oscillator for 32.768-kHz crystal or 32-kHz
purpose auxiliary LDOs are available to provide
built-in RC oscillator
power to other devices in the system, and two LDOs
are provided to power DDR memory supplies in
– Date, time and calendar
applications requiring these memories.
– Alarm capability
In addition to the power resources, the device
• One configurable GPIO
contains an embedded power controller (EPC) to
• DC-DC switching synchronization through
manage the power sequencing requirements of the
internal or external 3-MHz clock
OMAP systems and an (RTC).
Figure 1 shows the top-level diagram of the device.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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