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TPS70950DBVR 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
SOT-23-5
描述:
TEXAS INSTRUMENTS TPS70950DBVR 芯片, 稳压器, LDO, 固定, 0.15A, 5V, SOT-23-5 新
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P4Hot
典型应用电路图在P1P15
原理图在P13
封装尺寸在P20P21P22P23P25P26P27P28
标记信息在P20P21P22P23
封装信息在P18P19P20P21P22P23P24P25P26P27P28
技术参数、封装参数在P5
应用领域在P1P34
电气规格在P6
导航目录
TPS70950DBVR数据手册
Page:
of 34 Go
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EN
NC
OUT
GND
IN
1
2
3
5
4
IN
NC
EN
6
5
4
OUT
NC
GND
1
2
3
GND
EN
NC
GND
IN
OUT
1
2
3
5
4
OUT
NC
IN
GND
EN
1
2
3
5
4
TPS709
SBVS186G –MARCH 2012–REVISED NOVEMBER 2015
www.ti.com
5 Pin Configuration and Functions
TPS709: DBV Package
TPS709B: DBV Package
5-Pin SOT-23
5-Pin SOT-23
Top View
Top View
TPS709A: DBV Package
DRV Package
5-Pin SOT-23
6-Pin WSON
Top View
Top View
Pin Functions
PIN
DRV DBV I/O DESCRIPTION
NAME TPS709 TPS709 TPS709A TPS709B
Enable pin. Drive this pin high to enable the device. Drive this pin low
to put the device into low current shutdown. This pin can be left
EN 4 3 5 5 I
floating to enable the device. The maximum voltage must remain
below 6.5 V.
GND 3 2 2 1 — Ground
IN 6 1 3 2 I Unregulated input to the device
NC 2, 5 4 4 4 — No internal connection
Regulated output voltage. Connect a small 2.2-µF or greater ceramic
OUT 1 5 1 3 O
capacitor from this pin to ground to assure stability.
The thermal pad is electrically connected to the GND node. Connect
Thermal pad — — — —
this pad to the GND plane for improved thermal performance.
4 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: TPS709
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