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TPS767D301PWP 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
HTSSOP-28
描述:
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封装尺寸在P15P17P18
标记信息在P15P16
封装信息在P15P16P17P18
应用领域在P16P22
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TPS767D301PWP数据手册
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ABSOLUTE MAXIMUM RATINGS
(1)
POWER DISSIPATION RATINGS
TPS767D3xx
SLVS209H – JULY 1999 – REVISED AUGUST 2008 .........................................................................................................................................................
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS
(1)
DEVICE REGULATOR 1 V
OUT
(V) REGULATOR 2 V
OUT
(V)
TPS767D301 Adjustable (1.5V – 5.5V) 3.3V
TPS767D318 1.8V 3.3V
TPS767D325 2.5V 3.3V
(1) For the most current specifications and package information see the Package Option Addendum at the end of this document, or see the
TI web site at www.ti.com.
Over operating temperature range (unless otherwise noted).
TPS767D3xx UNIT
Input voltage range, V
1IN
, V
2IN
(2)
– 0.3 to +13.5 V
Enable voltage range, V
1EN
, V
2EN
– 0.3 to V
IN
+ 0.3 V
Output voltage range, V
1OUT
, V
2OUT
– 0.3 to +7.0 V
RESET voltage range, V
1RESET
, V
2RESET
– 0.3 to +16.5 V
Peak output current Internally limited
ESD rating, HBM 2 kV
Continuous total power dissipation See Dissipation Ratings table
Operating junction temperature range, T
J
– 40 to +125 ° C
Storage temperature range, T
stg
– 65 to +150 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network terminal ground.
AIR FLOW T
A
≤ +25 ° C DERATING FACTOR T
A
= +70 ° C T
A
= +85 ° C
PACKAGE (CFM) POWER RATING ABOVE t
a
= +25 ° C POWER RATING POWER RATING
0 3.58 W 35.8 mW/ ° C 1.97 W 1.43 W
PWP
(1)
250 5.07 W 50.7 mW/ ° C 2.79 W 2.03 W
(1) This parameter is measured with the recommended copper heat sink pattern on a 4-layer PCB, 1oz. copper on 4-in × 4-in ground layer.
For more information, refer to TI technical brief literature number SLMA002 .
2 Submit Documentation Feedback Copyright © 1999 – 2008, Texas Instruments Incorporated
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