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TS3A5018RGYR
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TS3A5018RGYR数据手册
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TS3A5018
SCDS189G JANUARY 2005REVISED MARCH 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)(2)
MIN MAX UNIT
V
+
Supply voltage
(3)
–0.5 4.6 V
V
NC
V
NO
Analog voltage
(3)(4)
–0.5 4.6 V
V
COM
I
K
Analog port diode current V
NC
, V
NO
, V
COM
< 0 –50 mA
I
NC
I
NO
ON-state switch current V
NC
, V
NO
, V
COM
= 0 to 7 V –64 64 mA
I
COM
V
I
Digital input voltage
(3)(4)
–0.5 4.6 V
I
IK
Digital input clamp current V
I
< 0 –50 mA
I
+
Continuous current through V
+
–100 100 mA
I
GND
Continuous current through GND –100 100 mA
T
stg
Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(3) All voltages are with respect to ground, unless otherwise specified.
(4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
6.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
(ESD)
Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22- ±1000
C101
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
I/O
Switch input and output voltage 0 V
+
V
V
+
Supply voltage 1.65 3.6 V
V
I
Control input voltage 0 3.6 V
T
A
Operating temperature -40 85 °C
6.4 Thermal Information
TS3A5018
D DBQ DGV PW RGY RSV
THERMAL METRIC
(1)
UNIT
(SOIC) (SSOP) (TVSOP) (TSSOP) (VQFN) (UQFN)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
R
θJA
Junction-to-ambient thermal resistance 73 90 120 108 51 184 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4 Submit Documentation Feedback Copyright © 2005–2015, Texas Instruments Incorporated
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