器件3D模型

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UC3825ADWTR 数据手册 - TI（德州仪器）

制造商:

TI（德州仪器）

分类:

PWM控制器

封装:

SOIC-16

描述:

高速PWM控制器 HIGH-SPEED PWM CONTROLLER

Pictures:

3D模型

符号图

焊盘图

引脚图

产品图

页面导航:

引脚图在P2Hot

原理图在P1P11

封装尺寸在P12P13P14P15P17P18

型号编码规则在P2

标记信息在P12P13P14P15

封装信息在P12P13P14P15P16P17P18

技术参数、封装参数在P3

应用领域在P16P19

电气规格在P4P5

导航目录

引脚图在P2
原理图在P1 P11
封装尺寸在P12 P13 P14 P15 P17 P18
型号编码规则在P2
标记信息在P12 P13 P14 P15
封装信息在P12 P13 P14 P15 P16 P17 P18
技术参数、封装参数在P3
应用领域在P16 P19
电气规格在P4 P5

UC3825ADWTR数据手册

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PACKAGE OPTION ADDENDUM

www.ti.com

3-May-2016

Addendum-Page 4

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

UC3825AN ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br)

CU NIPDAU N / A for Pkg Type 0 to 70 UC3825AN

UC3825ANG4 ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br)

CU NIPDAU N / A for Pkg Type 0 to 70 UC3825AN

UC3825AQ ACTIVE PLCC FN 20 46 Green (RoHS

& no Sb/Br)

CU SN Level-2-260C-1 YEAR 0 to 70 UC3825AQ

UC3825BDW ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3825BDW

UC3825BDWG4 ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3825BDW

UC3825BDWTR ACTIVE SOIC DW 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3825BDW

UC3825BN ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br)

CU NIPDAU N / A for Pkg Type 0 to 70 UC3825BN

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.