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XC3S1000-4FGG320I 数据手册 - Xilinx（赛灵思）
制造商:
Xilinx（赛灵思）
分类:
FPGA芯片
封装:
FBGA-320
描述:
XC3S1000 4FGG320I 磨码
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P1P107P108P109P110P111P119Hot
典型应用电路图在P32
原理图在P18
封装尺寸在P9
型号编码规则在P1P2P3P4P5P6P8
标记信息在P5P6P54P58
封装信息在P6P59P127
焊接温度在P6P59
功能描述在P1P9P10P11P12P13P14P15P16P17P18P19
技术参数、封装参数在P1P8P57P58P59P106P272
应用领域在P8P57P59P106P272
电气规格在P1P58
导航目录
XC3S1000-4FGG320I数据手册
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of 272 Go
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Spartan-3 FPGA Family: Introduction and Ordering Information
DS099 (v3.1) June 27, 2013 www.xilinx.com
Product Specification 5
Tabl e 3 shows the number of user I/Os as well as the number of differential I/O pairs available for each device/package
combination.
Package Marking
Figure 2 shows the top marking for Spartan-3 FPGAs in the quad-flat packages. Figure 3 shows the top marking for
Spartan-3 FPGAs in BGA packages except the 132-ball chip-scale package (CP132 and CPG132). The markings for the
BGA packages are nearly identical to those for the quad-flat packages, except that the marking is rotated with respect to the
ball A1 indicator. Figure 4 shows the top marking for Spartan-3 FPGAs in the CP132 and CPG132 packages.
The “
5C” and “4I” part combinations may be dual marked as “5C/4I”. Devices with the dual mark can be used as either -5C
or -4I devices. Devices with a single mark are only guaranteed for the marked speed grade and temperature range. Some
specifications vary according to mask revision. Mask revision E devices are errata-free. All shipments since 2006 have been
mask revision E.
Tabl e 3 : Spartan-3 Device I/O Chart
Available User I/Os and Differential (Diff) I/O Pairs by Package Type
Package
VQ100
VQG100
CP132
(1)
CPG132
TQ144
TQG144
PQ208
PQG208
FT256
FTG256
FG320
FGG320
FG456
FGG456
FG676
FGG676
FG900
FGG900
FG1156
(1)
FGG1156
Footprint
(mm)
16x16
8x8 22x22 30.6x30.6 17x17 19x19 23x23 27x27 31x31 35 x 35
Device User Diff
User Diff User Diff User Diff User Diff User Diff User Diff User Diff User Diff User Diff
XC3S50 63 29
89
(1)
44
(1)
97 46 124 56 – – – – – – – – – – – –
XC3S200 63 29 – – 97 46 141 62 173 76 – – – – – – – – – –
XC3S400 – – – – 97 46 141 62 173 76 221 100 264 116 – – – – – –
XC3S1000 – – – – – – – – 173 76 221 100 333 149 391 175 – – – –
XC3S1500 – – – – – – – – – – 221 100 333 149 487 221 – – – –
XC3S2000 – – – – – – – – – – – – 333 149 489 221 565 270 – –
XC3S4000 – – – – – – – – – – – – – – 489 221 633 300
712
(1)
312
(1)
XC3S5000 – – – – – – – – – – – – – – 489 221 633 300
784
(1)
344
(1)
Notes:
1. The CP132, CPG132, FG1156, and FGG1156 packages are discontinued. See
h
ttp://www.xilinx.com/support/documentation/spartan-3_customer_notices.htm.
2. All device options listed in a given package column are pin-compatible.
3. User = Single-ended user I/O pins. Diff = Differential I/O pairs.
X-Ref Target - Figure 2
Figure 2: Spartan-3 FPGA QFP Package Marking Example for Part Number XC3S400-4PQ208C
DS099-1_03_050305
Lot Code
Date Code
Mask Revision Code
Process Technology
XC3S400
TM
PQ208EGQ0525
D1234567A
4C
SPARTAN
Device Type
Package
Speed Grade
Temperature Range
Fabrication Code
Pin P1
R
R
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