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器件3D模型￥ 0.806
74AHCT595PW,118 其他数据使用手册 - NXP（恩智浦）
制造商:
NXP（恩智浦）
分类:
移位寄存器
封装:
TSSOP-16
描述:
NXP 74AHCT595PW,118 移位寄存器, AHCT系列, 高速CMOS, 串行至并行、串行至串行, 1元件, TSSOP, 16 引脚, 4.5 V, 5.5 V
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74AHCT595PW,118数据手册
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Customer Information Notification
201611038I
Issue Date: 10-Dec-2016
Effective Date: 09-Jan-2017
Here's your personalized quality information
concerning products Digi-Key purchased from NXP.
For detailed information we invite you to view this
notification online
Change Category
[ ] Wafer Fab
Process
[ ] Assembly
Process
[ ] Product Marking
[ ] Test
Location
[ ] Design
[ ] Wafer Fab
Materials
[ ] Assembly
Materials
[ ] Mechanical Specification
[ ]Test Process
[ ] Errata
[ ] Wafer Fab
Location
[ ] Assembly
Location
[X]
Packing/Shipping/Labeling
[ ] Test
Equipment
[ ] Electrical spec./Test
coverage
Nexperia Company Name for BU Standard Products Affects Packing and
Labels
Information Notification
In Q1 2017 NXP Business Units Standard Products will continue as a standalone company, Nexperia. As a
result of this change the packing and labelling on the product portfolio will change from NXP to Nexperia.
The NXP logo or words 'NXP Semiconductors' will be replaced by the Nexperia Logo or wording 'Nexperia'
respectively.
From the implementation date onwards the new company name will be phased in, both the new and the old
labeling will be shipped in parallel for a certain transition period. The details about the appearance of the
new labels and logo are attached.
The affected product types can be found in the attached type list.
Why do we issue this Information Notification
To inform customers on the visible changes in packing and labels reflecting the new company name.
Identification of Affected Products
Packing labels
Labels and packing material will reflect the Nexperia branding.
Impact
no impact to the product's functionality anticipated.
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