Datasheet 搜索 > FPGA芯片 > Microsemi（美高森美） > A42MX16-3TQG176 数据手册 > A42MX16-3TQG176 产品修订记录 1/5 页
器件3D模型￥ 953.314
A42MX16-3TQG176 产品修订记录 - Microsemi（美高森美）
制造商:
Microsemi（美高森美）
分类:
FPGA芯片
封装:
TQFP-176
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P1
导航目录
A42MX16-3TQG176数据手册
Page:
of 5 Go
若手册格式错乱，请下载阅览PDF原文件
Microsemi Corporate Headquarters
One Enterprise, Aliso Viejo CA 92656 USA
Within the USA: +1(800) 713-4113, Outside the USA: +1 (949) 380-6100 ·
Sales: +1 (949) 380-6136, Fax: +1 (949) 215-4996 ·
E-mail: sales.support@microsemi.com
1
Microsemi Corporation
November 5, 2015
Product/Process Change Notification No: PCN1504
Change Classification: Major
Subject: Transfer of Assembly Support for VQG176, VQG128, and TQG176 from Amkor Taiwan (ATT1) to
Amkor Philippines (ATP1), and a Minor Change in the Physical Appearance of VQG128 and VQG176
Description of Change
Devices listed in Appendix A will have the assembly support transferred from ATT1 to ATP1 facility.
Additionally, the VQG176 and VQG128 packages at the ATP1 facility use the Pin Gate molding process and a mold
compound material optimum for that process. The mold gate mark will appear on the top side of the package.
There is no change in the critical dimension of the Package Outline Drawing. There is no change in the device fit and the
electrical and thermal performance.
Reason for Change
Microsemi’s assembly sub-contract facility, Amkor, will discontinue the lead frame assembly support at ATT1 by the end
of 2015 and will consolidate the assembly support at ATP1.
Upon transfer to ATP1, the VQG176 and VQG128 will utilize an improved lead frame format (which will allow for more
units in a lead frame strip). The use of the pin gate molding process and an optimum molding material is necessary as
part of the lead frame format change. This process has mold entering from the top side and has an identifiable mark (pin
gate). Refer to Figure 1 for additional details.
Application Impact
There is no expected impact to customer applications.
For TQG176, ATP1 will use same set of materials as what is being used at ATT1, and will be produced in the same way
as ATT1. There is no impact on quality and reliability as ATP1 and ATT1 use identical process control.
For VQG128 and VQG176, the mold gate mark does not affect the critical dimension of the Package Outline Drawing.
This also does not impact the device specification as stated in the product data sheets.
Method of Identifying Changed Product
The country from which the units were assembled is marked on the top side of the package. Those assembled at ATT1
shows TWN on the marking while those to be built at ATP1 shows PHL.
For VQG128 and VQG176 packages utilizing the pin gate molding process built at ATP1 can be distinguished by the
mold gate mark at the top side of the package. Refer to Figure 1 at the right side below.
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
