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AD7891BSZ-2 产品修订记录 - ADI（亚德诺）
制造商:
ADI（亚德诺）
分类:
AD转换器
封装:
QFP-44
描述:
ANALOG DEVICES AD7891BSZ-2 模数转换器, 12 bit, 500 kSPS, 单, 5 V, MQFP
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AD7891BSZ-2数据手册
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Product/Process Change Notice - PCN 16_0034 Rev. B
Analog Devices, Inc. Three Technology Way Norwood, Massachusetts 02062-9106
This notice is to inform you of a change that will be made to certain ADI products (see Appendix A) that you may have purchased in the
last 2 years. Any inquiries or requests with this PCN (additional data or samples) must be sent to ADI within 30 days of
publication date. ADI contact information is listed below.
Note: Revised fields are indicated by a red field name. See Appendix B for revision history.
PCN Title: Assembly Relocation of Select LQFP,LQFP_EP,MQFP,TQFP,TQFP_EP Products to
Stats ChipPAC China Jiangyin
Publication Date: 08-Aug-2016
Effectivity Date: 06-Nov-2016 (the earliest date that a customer could expect to receive changed material)
Revision Description:
Added qualification results for LQFP Automotive devices.
Update LQFP_EP and MQFP qual plan summary with new expected completion date.
Description Of Change
The assembly of select LQFP, LQFP_EP, MQFP, TQFP, and TQFP_EP products are relocating from STATS ChipPAC China Shanghai to
STATS ChipPAC China Jiangyin. The package outline dimensions and BOM of each product will be maintained.
Rev B effectivity date applies to LQFP_EP and MQFP qual plan summary with new expected completion date.
Reason For Change
STATS ChipPAC Shanghai China Assembly Plant is relocating to Stats ChipPAC Jiangyin China at the end of September 2017.
ADI's assembly subcontractors manufacture products using Analog Devices specified manufacturing flows, materials,
process controls and monitors, ensuring the same level of quality and reliability on products they received from
the new site.
Impact of the change (positive or negative) on fit, form, function & reliability
There will be no impact on the form, fit, function and reliability of the devices.
Product Identification (this section will describe how to identify the changed material)
The products that will be assembled after the transfer will be identified by assembly lot and the country of origin.
Summary of Supporting Information
Qualifications are in process per AEC-Q100, Stress Test Qualification for Integrated Circuits. See attached Qualification Plans and
Summaries.
Comments
During transition from the current site to the new assembly site, products could be assembled from the current assembly or the new
assembly site once qualified.
Analog Devices, Inc. PCN 16_0034_Rev_B Page 1 of 7
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