Datasheet 搜索 > 放大器IC与RF模块 > ADI（亚德诺） > ADA4304-2ACPZ-R7 数据手册 > ADA4304-2ACPZ-R7 产品修订记录 1/5 页
器件3D模型￥ 4.606
ADA4304-2ACPZ-R7 产品修订记录 - ADI（亚德诺）
制造商:
ADI（亚德诺）
分类:
放大器IC与RF模块
封装:
LFCSP-16
描述:
ANALOG DEVICES ADA4304-2ACPZ-R7 芯片, 射频分接器, 1.6GHZ, LFCSP-16
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P1
型号编号列表在P3
导航目录
ADA4304-2ACPZ-R7数据手册
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of 5 Go
若手册格式错乱，请下载阅览PDF原文件
Product/Process Change Notice - PCN 14_0038 Rev. -
Analog Devices, Inc. Three Technology Way Norwood, Massachusetts 02062-9106
This notice is to inform you of a change that will be made to certain ADI products (see Material Report). Any issues with this PCN or
requirements to qualify the change (additional data or samples) must be sent to ADI within 30 days of publication date. ADI contact
information is listed below.
PCN Title: Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and
Transfer of Assembly Site to Amkor Philippines.
Publication Date: 13-Feb-2014
Effectivity Date: 14-May-2014 (the earliest date that a customer could expect to receive changed material)
Revision Description:
Initial Release
Description Of Change
ADI has qualified and will be utilizing Assembly subcontractor Amkor in Philippines for 3x3mm body size LFCSP products. ADI has also
qualified Amkor's standard bill of materials in a SAWN singulated leadframe. There will be no change in BOM. Pin1 indicator will be laser
marked as part of the change. See attached for changes and package outline differences.
Reason For Change
Sawn LFCSP is ADI's technology direction for LFCSP. The use of ADI qualified Amkor-Philippines as an assembly site will ensure continued
source of product supply. ADI's assembly subcontractors manufacture our products using Analog Devices specified manufacturing flows,
process controls and monitors. This assures that our customers receive the same level of quality and reliability on products they receive
from qualified ADI manufacturing locations.
Impact of the change (positive or negative) on fit, form, function & reliability
The devices function and reliability as specified by the product datasheet will be unaffected by these changes. The Lead Foot Print Dimension
will remain the same for both punch and sawn LFCSP packages
Summary of Supporting Information
Qualification has been performed per ADI0012, Procedure for Qualification of New or Revised Processes. See attached Qualification Report
Summary.
Supporting Documents
Attachment 1: Type: Qualification Report Summary
ADI_PCN_14_0038_Rev_-_Reliability Qualification Summary.pdf
Attachment 2: Type: Detailed Change Description
ADI_PCN_14_0038_Rev_-_Materials and Package Configuration.pdf
Attachment 3: Type: Package Outline Drawing
ADI_PCN_14_0038_Rev_-_Package Outline Drawing.pdf
Analog Devices, Inc. PCN 14_0038_Rev_- Page 1 of 5
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