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ADUM1301ARWZ 其他数据使用手册 - ADI（亚德诺）
制造商:
ADI（亚德诺）
分类:
接口隔离器
封装:
SOIC-16
描述:
ANALOG DEVICES ADUM1301ARWZ 数字隔离器, 3通道, 100 ns, 2.7 V, 5.5 V, SOIC, 16 引脚
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ADUM1301ARWZ数据手册
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AN-0971
APPLICATION NOTE
One Technology Way • P. O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com
Recommendations for Control of Radiated Emissions with isoPower Devices
by Mark Cantrell
Rev. C | Page 1 of 20
INTRODUCTION
iCoupler® digital isolators with integrated isolated power
(isoPower®) employ isolated dc-to-dc converters that switch
currents of ~700 mA at frequencies as high as 300 MHz.
Operation at these high frequencies raises concerns about
radiated emissions and conducted noise. PCB layout and
construction is a very important tool for controlling radiated
emissions and noise from applications containing isoPower
components. This application note identifies the radiation
mechanisms and offers specific guidance on addressing them.
Several standards for radiated emissions exist. In the U.S.,
the Federal Communications Commission (FCC) controls
the standards and test methods. In Europe, the International
Electrotechnical Commission (IEC) generates standards, and
CISPR test methods are used for evaluating emissions. The
methods and pass/fail limits are slightly different under the
two standards. Although this application note is written with
reference to CISPR standards, all results are applicable to both
standards.
With proper design choices, isoPower devices can easily meet
CISPR Class A (FCC Class A) emissions standards. With care,
these products can also meet CISPR Class B and FCC Part 15,
Subpart B, Class B (FCC Class B) standards in an unshielded
environment. This application note examines PCB-related EMI
mitigation techniques, including board layout and stack-up issues.
The techniques, example layouts, and measurements described in
this application note are highly dependent on the options available
in PCB construction. A 4-layer PCB is required to implement the
evaluated EMI control techniques. Availability of more internal
PCB layers offers the same EMI reductions within smaller geome-
try PCBs. For the purposes of this application note, a 4-layer board
was designed and manufactured using materials and structures well
within industry norms.
Control of emissions from signal cables and chassis shielding
techniques are outside of the scope of this application note.
OSC REG
RECT
OPEN LOOP WITH LINEAR REGULATOR
ADuM524x
OSC REGRECT
FULL FEEDBACK PWM CONTROL
ADuM540x, ADuM520x, ADuM5000
OSC
PWM
RECT
OPEN LOOP WITH PWM CONTROL
ADuM5230, ADuM6132
07541-001
Figure 1. isoPower Architectures
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