Datasheet 搜索 > 微处理器 > TI（德州仪器） > AM3354BZCZD60 数据手册 > AM3354BZCZD60 其他数据使用手册 1/57 页
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AM3354BZCZD60 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
微处理器
封装:
PBGA-324
描述:
的Sitara AM335x ARM Cortex-A8的微处理器（MPU ） Sitara AM335x ARM Cortex-A8 Microprocessors (MPUs)
Pictures:
3D模型
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页面导航:
原理图在P2P23P27P41P42
封装尺寸在P43P50P51P52P53
标记信息在P47P50P51P52P53P54
封装信息在P49P50P51P52P53P54
技术参数、封装参数在P8P9P10P11P12P13P14P15P16P17P18P19
应用领域在P1P41P42P43P44P45P46P54P57
电气规格在P11
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AM3354BZCZD60数据手册
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CC2564C
SWRS199A –APRIL 2016–REVISED NOVEMBER 2016
CC2564C Dual-Mode Bluetooth
®
Controller
1 Device Overview
1
1.1 Features
1
• TI's Single-Chip Bluetooth
®
Solution With
Bluetooth Basic Rate (BR), Enhanced Data Rate
(EDR), and Low Energy (LE) Support
• Bluetooth 4.2 Component Qualified (Declaration
ID: D032801); Compliant up to the HCI Layer
• Highly Optimized for Size-Constrained and Low-
Cost Designs:
– Single-Ended 50-Ω RF Interface
– Package Footprint: 76 Terminals, 0.6-mm Pitch,
8-mm × 8-mm (VQFNP-MR)
• BR and EDR Features Include:
– Up to Seven Active Devices
– Scatternet: Up to Three Piconets
Simultaneously, One as Master and Two as
Slaves
– Up to Two Synchronous Connection Oriented
(SCO) Links on the Same Piconet
– Support for All Voice Air-Coding—Continuously
Variable Slope Delta (CVSD), A-Law, µ-Law,
Modified Subband Coding (mSBC), and
Transparent (Uncoded)
– Provide an Assisted Mode for HFP 1.6
Wideband Speech (WBS) Profile or A2DP
Profile to Reduce Host Processing and Power
– Support of Multiple Bluetooth Profiles With
Enhanced QoS
• Low Energy Features Include:
– Multiple Sniff Instances Tightly Coupled to
Achieve Minimum Power Consumption
– Independent Buffering for Low Energy Allows
Large Numbers of Multiple Connections Without
Affecting BR or EDR Performance
– Built-In Coexistence and Prioritization Handling
for BR, EDR, and Low Energy
– Capabilities of Link Layer Topology
Scatternet—Can Act Concurrently as Peripheral
and Central
– Network Support for up to 10 Devices
– Time Line Optimization Algorithms to Achieve
Maximum Channel Utliization
• Best-in-Class Bluetooth (RF) Performance (TX
Power, RX Sensitivity, Blocking)
– Class 1 TX Power up to +12 dBm
– Internal Temperature Detection and
Compensation to Ensure Minimal Variation in
RF Performance Over Temperature, No
External Calibration Required
– Improved Adaptive Frequency Hopping (AFH)
Algorithm With Minimum Adaptation Time
– Longer Range, Including Twice the Range of
Other Low-Energy-Only Solutions
• Advanced Power Management for Extended
Battery Life and Ease of Design
– On-Chip Power Management, Including Direct
Connection to Battery
– Low Power Consumption for Active, Standby,
and Scan Bluetooth Modes
– Shutdown and Sleep Modes to Minimize Power
Consumption
• Physical Interfaces:
– UART Interface With Support for Maximum
Bluetooth Data Rates
• UART Transport Layer (H4) With Maximum
Rate of 4 Mbps
• Three-Wire UART Transport Layer (H5) With
Maximum Rate of 4 Mbps
– Fully Programmable Digital Pulse-Code
Modulation (PCM)–Inter-IC Sound (I2S) Codec
Interface
• Flexibility for Easy Stack Integration and Validation
Into MCUs and MPUs
• CC256x Bluetooth Hardware Evaluation Tool:
PC-Based Application to Evaluate RF Performance
of the Device and Configure Service Pack
1.2 Applications
• Wireless Audio Solutions
• mPOS
• Medical Devices
• Set-Top Boxes (STBs)
• Wearable Devices
• Sensor Hub, Sensor Gateway
– Home and Factory Automation
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