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BDX33C 其他数据使用手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
双极性晶体管
封装:
TO-220-3
描述:
STMICROELECTRONICS BDX33C 单晶体管 双极, 达林顿, NPN, 100 V, 70 W, 10 A, 750 hFE
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BDX33C数据手册
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PRODUCT / PROCESS CHANGE INFORMATION
1. PCI basic data
1.1 Company STMicroelectronics International N.V
1.2 PCI No. CRP/19/11478
1.3 Title of PCI PRODUCT ALERT / Early Notification - DISCONTINUATION OF CURRENT MOLD COMPOUNDS
(SAMSUNG SDI) FOR THROUGH HOLE PACKAGES
1.4 Product Category Refer to FG list
1.5 Issue date 2019-04-08
2. PCI Team
2.1 Contact supplier
2.1.1 Name KRISZTINA NEMETH
2.1.2 Phone +49 89460062210
2.1.3 Email krisztina.nemeth@st.com
2.2 Change responsibility
2.2.1 Process Owner Chiara ZACCHERINI
2.1.2 Corporate Quality Manager Gerard PETIT
3. Change
3.1 Category 3.2 Type of change 3.3 Manufacturing Location
Materials New direct material part number (same
supplier, different supplier or new supplier),
Mold compound
Several locations
4. Description of change
Old New
4.1 Description Samsung SDI product termination of the
following references of molding compound for
through hole packages
SG8200DTA
SG8200DTB / 1
SG-8100G / GS / GSA
SI-7200DXC
SG8100GSP
SI-7200DX2
ST-7100HF
Replacement of current mold compounds with
alternative material. ST is already proceeding
with new resins evaluation and qualification, to
guarantee adequate products continuity.
4.2 Anticipated Impact on form,fit,
function, quality, reliability or
processability?
Product Alert / Early Notification
The change will be notified to customers by PCN sent by product divisions from Q2 2019
depending on the products and packages families.
5. Reason / motivation for change
5.1 Motivation Replacement of current mold compounds with alternative material. ST is already proceeding
with new resins evaluation and qualification, to guarantee adequate products continuity.
5.2 Customer Benefit SERVICE CONTINUITY
6. Marking of parts / traceability of change
6.1 Description Not applicable at this stage
7. Timing / schedule
7.1 Date of qualification results 2019-04-05
7.2 Intended start of delivery 2019-04-05
7.3 Qualification sample available? Not Applicable
8. Qualification / Validation
8.1 Description
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