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BZX84C5V1W-7-F 产品封装文件 - Diodes Zetex（捷特科）
制造商:
Diodes Zetex（捷特科）
分类:
齐纳二极管
封装:
SOT-323
描述:
200mW，BZX84C 系列，Diodes Inc表面安装外壳：SOT-363 ### 齐纳二极管，Diodes Inc
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3D模型
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BZX84C5V1W-7-F数据手册
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BZX84C2V4W - BZX84C39
W
200mW SURFACE MOUNT ZENER DIODE
Features
• Planar Die Construction
• 200mW Power Dissipation
• Zener Voltages from 2.4V – 39V
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 4)
• "Green" Device (Notes 1 and 2)
Mechanical Data
• Case: SOT-323
• Case Material: Molded Plastic, "Green" Molding Compound,
Note 2. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: See Diagram
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.006 grams (approximate)
Top View
Device Schematic
Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Forward Voltage @ I
F =
10mA V
F
0.9 V
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 3)
P
D
200 mW
Thermal Resistance, Junction to Ambient Air (Note 3)
R
θ
JA
625 K/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +125
°C
Notes: 1. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com./products/lead_free/index.php.
2. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
3. Mounted on FR4 PC board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
4. No purposefully added lead.
BZX84C2V4W - BZX84C39W
Document number: DS30066 Rev. 15 - 2
1 of 4
www.diodes.com
May 2008
© Diodes Incorporated
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