Datasheet 搜索 > 陶瓷电容 > TDK（东电化） > C4520X7R3D102K130KA 数据手册 > C4520X7R3D102K130KA 产品手册 1/2 页
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C4520X7R3D102K130KA 产品手册 - TDK（东电化）
制造商:
TDK（东电化）
分类:
陶瓷电容
封装:
1808
描述:
TDK C4520X7R3D102K130KA 多层陶瓷电容器, 表面贴装, C系列, 1000 pF, ± 10%, X7R, 2 kV, 1808 [4520 公制]
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C4520X7R3D102K130KA数据手册
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74
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
High Voltage MLC Chips
For 600V to 5000V Application
HOW TO ORDER
DIMENSIONS
millimeters (inches)
SIZE 0805 1206 1210* 1808* 1812* 1825* 2220* 2225* 3640*
(L) Length 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20 4.57 ± 0.25 4.50 ± 0.30 4.50 ± 0.30 5.70 ± 0.40 5.72 ± 0.25 9.14 ± 0.25
(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)
(W) Width 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20 2.03 ± 0.25 3.20 ± 0.20 6.40 ± 0.30 5.00 ± 0.40 6.35 ± 0.25 10.2 ± 0.25
(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)
(T) Thickness 1.30 1.52 1.70 2.03 2.54 2.54 3.30 2.54 2.54
Max. (0.051) (0.060) (0.067) (0.080) (0.100) (0.100) (0.130) (0.100) (0.100)
(t) terminal min. 0.50 ± 0.25 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.76 (0.030)
max. (0.020 ± 0.010) 0.75 (0.030) 0.75 (0.030) 1.02 (0.040) 1.02 (0.040) 1.02 (0.040) 1.02 (0.040) 1.02 (0.040) 1.52 (0.060)
High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC
chip capacitors meet these performance characteristics and are
designed for applications such as snubbers in high frequency power
converters, resonators in SMPS, and high voltage coupling/dc blocking.
These high voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to make
high voltage MLC chip products. Special precautions must be taken in
applying these chips in surface mount assemblies. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak tem-
perature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors
may require protective surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either
thru-hole or SMT configurations (for details see section on high voltage
leaded MLC chips).
*Reflow Soldering Only
W
L
T
t
1808
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
3640
A
Voltage
600V/630V = C
1000V = A
1500V = S
2000V = G
2500V = W
3000V = H
4000V = J
5000V = K
A
Temperature
Coefficient
C0G = A
X7R = C
271
Capacitance Code
(2 significant digits
+ no. of zeros)
Examples:
10 pF = 100
100 pF = 101
1,000 pF = 102
22,000 pF = 223
220,000 pF = 224
1 µF = 105
K
Capacitance
Tolerance
C0G:J = ±5%
K = ±10%
M = ±20%
X7R:K = ±10%
M = ±20%
Z = +80%,
-20%
A
Test Level
A = Standard
1
Termination*
1 = Pd/Ag
T = Plated
Ni and Sn
(RoHS Compliant)
1
Packaging
1 = 7" Reel
3 = 13" Reel
9 = Bulk
A
Special
Code
A = Standard
*Note: Terminations with 5% minimum lead (Pb) is available, see pages 76 and 77 for LD style.
Leaded terminations are available, see pages 80 and 81.
NEW 630V RANGE
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