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CC1101RGPR 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
RF射频器件
封装:
QFN-20
描述:
TEXAS INSTRUMENTS CC1101RGPR 芯片, 射频收发器, QFN-20
Pictures:
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电气规格在P1
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CC1101RGPR数据手册
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若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Incorporated PCN#20180319003
PCN Number:
20180319003
PCN Date:
March 29 2018
Title:
Qualification of an additional material set for select devices in the QFN package
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
June 29 2018
Estimated Sample
Availability:
Provided upon
Request
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
Part number change
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of an additional material set for the
devices listed in pg 2 of this notification as follows:
Current
Additional
Mount Compound
4207768
4207123
Mold Compound
4208625
4222198
Reason for Change:
Continuity of Supply
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
None
Anticipated impact on Material Declaration
No Impact to the
Material Declaration
Material Declarations or Product Content reports are driven from
production data and will be available following the production
release. Upon production release the revised reports can be
obtained from the TI ECO website.
Changes to product identification resulting from this PCN:
Not Applicable
Product Affected
See Page 2
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