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CD4052BM96G3 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
接口芯片
封装:
SOIC-16
描述:
TEXAS INSTRUMENTS CD4052BM96G3 芯片, 多路复用器/分离器, 双路, 4X1, 16SOIC
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CD4052BM96G3数据手册
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若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN# 20141105000
PCN Number:
20141105000
PCN Date:
12/03/2014
Title:
Qualification of new BOM and Assembly Site for Select Device(s)
Customer
Contact:
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality Services
Proposed 1
st
Ship
Date:
03/03/2015
Estimated Sample Availability:
Date provided at
sample request
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of new material set for the devices listed
in Group 1 below and a new assembly site and material set for the devices listed in Group 2 listed
below:
Group 1 will add Cu wire as a bond wire option. Devices will remain in current assembly facility.
Group 2 will add a new assembly site and Cu wire as a bond wire option.
Group 1 Devices:
Current
New
Bond Wire type
Au
Cu, Au
Group 2 Devices:
Current New
Assembly Site SCSAT TI Clark
Mount Compound R008-0097X 4207123
Mold Compound R003-0301X 4208625
Bond Wire Type Au Cu, Au
Punch Saw
Package Singulation
Note: The sawn package is considered backwards compatible with the punched package, i.e. no PCB
footprint change is necessary. Packing materials (shipping boxes, tape & reels, etc.) at the
additional site will be consistent with materials currently in use at the current site.
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