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DSPIC30F2010T-30I/MM 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-28
描述:
数字信号处理器和控制器 - DSP, DSC 16B MCU DSP 28LD 20MIPS 12KB FLASH
Pictures:
3D模型
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焊盘图
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页面导航:
型号编号列表在P4
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DSPIC30F2010T-30I/MM数据手册
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of 55 Go
若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - LIAL-21URFI599
Date:
24 May 2018
Product Category:
Digital Potentiometers; Capacitive Touch Sensors; 8-bit PIC Microcontrollers; 16-Bit -
Microcontrollers and Digital Signal Controllers; 32-bit PIC Microcontrollers; Sensor Fusion Hub;
USB Power Delivery; Ethernet Controllers; Hybrid Controllers; Others; Touch Controllers; USB
Bridge; Interface- Serial Peripherals; Energy Measurement
Affected CPNs:
Notification subject:
CCB 3223, 3223.001-3223.007 Final Notice: Qualification of MMT as an additional assembly site
for selected products of 0.25um, 0.18um TSMC, 70nm SMIC, Vanguard,120K,130K, 150K, 160K,
165K, 200K and 290K wafer technologies in 44L, 28 QFN-S, 20L,16L and 28L QFN packages.
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm SMIC,
Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies in 44L, 28 QFN-S, 20L,16L and 28L
QFN packages.
Pre Change:
Assembled at MTAI assembly site
Post Change:
Assembled at MTAI or MMT assembly site
Pre and Post Change Summary:
Impacts to Data Sheet:
None
Change Impact:
None
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand HQ (MTAI)
Microchip Technology
Thailand HQ (MTAI)
Microchip Technology
Thailand Branch (MMT)
Wire material Au Au
Die attach material 3280 3280
Molding compound
material
G700LTD G700LTD
Lead frame material C194 C194
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