Datasheet 搜索 > 稳压芯片 > ST Microelectronics(意法半导体) > L7912ACV 数据手册 > L7912ACV 产品修订记录 1/3 页

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L7912ACV 产品修订记录 - ST Microelectronics(意法半导体)
制造商:
ST Microelectronics(意法半导体)
分类:
稳压芯片
封装:
TO-220-3
描述:
STMICROELECTRONICS L7912ACV 固定电压稳压器, LDO, 7912, -35V至-19V, 1.1V压差, -12V输出, 1.5A输出, TO-220-3
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L7912ACV数据手册
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PRODUCT / PROCESS CHANGE NOTIFICATION
1. PCN basic data
1.1 Company STMicroelectronics International N.V
1.2 PCN No. AMS/20/11950
1.3 Title of PCN Qualification of a new plating process for selected products in TO220 package
1.4 Product Category See product list
1.5 Issue date 2020-02-17
2. PCN Team
2.1 Contact supplier
2.1.1 Name FRANCKE CHRISTIANE
2.1.2 Phone +49 89460062128
2.1.3 Email christiane.francke@st.com
2.2 Change responsibility
2.2.1 Product Manager Marcello SAN BIAGIO
2.1.2 Marketing Manager Salvatore DI VINCENZO
2.1.3 Quality Manager Sergio Tommaso SPAMPINATO
3. Change
3.1 Category 3.2 Type of change 3.3 Manufacturing Location
Transfer Line transfer for a full process or process brick
(process step, control plan, recipes) from one
site to another site: Assembly site (SOP 2617)
Assembly : ST SHENZHEN (CHINA)
4. Description of change
Old New
4.1 Description Plating process:
Plating in house on Jettech MC with ROMAN
HAAS and ATOTECH chemical
Plating process:
Plating outsourcing on AEM MC with local
(SYUNDAI) chemical
4.2 Anticipated Impact on form,fit,
function, quality, reliability or
processability?
No impact
5. Reason / motivation for change
5.1 Motivation The outsourcing of the plating process will help us to improve manufacturing flexibility and
provide a better delivery service to our customers.
5.2 Customer Benefit MANUFACTURING FLEXIBILITY
6. Marking of parts / traceability of change
6.1 Description By internal codification and traceability code
7. Timing / schedule
7.1 Date of qualification results 2020-01-14
7.2 Intended start of delivery 2020-05-21
7.3 Qualification sample available? Upon Request
8. Qualification / Validation
8.1 Description 11950 W943-2020-New plating outsourcing on TO220_XL05_L317.pdf
8.2 Qualification report and
qualification results
Available (see attachment) Issue
Date
2020-02-17
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