Datasheet 搜索 > 稳压芯片 > ST Microelectronics（意法半导体） > LD1117D33TR 数据手册 > LD1117D33TR 产品修订记录 1/3 页
器件3D模型￥ 0.637
LD1117D33TR 产品修订记录 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
稳压芯片
封装:
SOIC-8
描述:
800mA，STMicroelectronics
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LD1117D33TR数据手册
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PRODUCT / PROCESS CHANGE NOTIFICATION
1. PCN basic data
1.1 Company STMicroelectronics International N.V
1.2 PCN No. AMS/18/10892
1.3 Title of PCN Qualification of subcontractor TSHT (China) as additional assembly plant for selected products
of General Purpose Analog Division in SO8 package.
1.4 Product Category See product list
1.5 Issue date 2018-05-24
2. PCN Team
2.1 Contact supplier
2.1.1 Name MARSHALL DAVE
2.1.2 Phone
2.1.3 Email dave.marshall@st.com
2.2 Change responsibility
2.2.1 Product Manager Lorenzo NASO
2.1.2 Marketing Manager Marcello SAN BIAGIO
2.1.3 Quality Manager Jean-Marc BUGNARD
3. Change
3.1 Category 3.2 Type of change 3.3 Manufacturing Location
Transfer Line transfer for a full process or process brick
(process step, control plan, recipes) from one
site to another site: Assembly site (SOP 2617)
Subcontractor TSHT (China)
4. Description of change
Old New
4.1 Description Assembly :
- ST Bouskoura (Morocco)
- ST Shenzhen (China)
Assembly :
- ST Bouskoura (Morocco)
- ST Shenzhen (China)
- Subcontractor TSHT (China)
4.2 Anticipated Impact on form,fit,
function, quality, reliability or
processability?
No impact
5. Reason / motivation for change
5.1 Motivation The purpose of this change is to improve the rationalization of our manufacturing assets,
provide a better support to our customers by enhancing the manufacturing process for higher
volume production.
5.2 Customer Benefit SERVICE IMPROVEMENT
6. Marking of parts / traceability of change
6.1 Description New finished good codes
7. Timing / schedule
7.1 Date of qualification results 2018-05-14
7.2 Intended start of delivery 2018-08-20
7.3 Qualification sample available? Upon Request
8. Qualification / Validation
8.1 Description 10892 ExternalReliabilityEvaluationReport_TSHT-LP.pdf
8.2 Qualification report and
qualification results
Available (see attachment) Issue
Date
2018-05-24
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