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LM2901DR2G 产品修订记录 - ON Semiconductor(安森美)
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TEM001092 Rev. E Page 1 of 3
Final Product/Process Change Notification
Document # : FPCN20984X
Issue Date: 22 July 2015
Title of Change:
Foundry capacity expansion to Hangzhou Silan Integrated Circuit Co. LTD (Silan) and op amp & comparator
design change for all wafer fab facilities
Proposed first ship date:
29 October 2015
Contact information:
Contact your local ON Semiconductor Sales Office or <Shannon.Riggs@onsemi.com>
Samples:
Contact your local ON Semiconductor Sales Office
Additional Reliability Data:
Contact your local ON Semiconductor Sales Office or <Ken.Fergus@onsemi.com>.
Type of notification:
This is a Final Product/Process Change Notification (FPCN) sent to customers. FPCNs are issued 90 days prior
to implementation of the change.
ON Semiconductor will consider this change accepted, unless an inquiry is made in writing within 30 days of
delivery of this notice. To do so, contact <PCN.Support@onsemi.com>.
Change Part Identification:
Changed part identification will be distinguished by manufacturing date code and lot traceability. Changed
material will be sourced on or after W40, 2015 depending on inventory depletion schedules.
External package labels (bar codes) will identify the fab source location.
Change category:
Wafer Fab Change Assembly Change Test Change Other _______________
Change Sub-Category(s):
Manufacturing Site Change/Addition
Manufacturing Process Change
Material Change
Product specific change
Datasheet/Product Doc change
Shipping/Packaging/Marking
Other: _Design Change
Sites Affected:
All site(s) not applicable
ON Semiconductor site(s) :
ON Roznov, Czech Republic
External Foundry/Subcon site(s)
Hangzhou Silan Integrated Circuit
Co., LTD
Description and Purpose:
In order to provide best in class supply continuity, ON Semiconductor is pleased to announce Hangzhou Silan Integrated Circuit Co. LTD (Silan)
has been qualified as an alternate supply source for general purpose, bipolar analog op-amp and comparator products. Additionally, and as part
of ON Semiconductor’s continuous improvement efforts, the affected designs have been modified in both the ON Semiconductor’s Rosnov
(Rosnov) and Silan wafer fabrication facilities. Both fab locations will provide the same design version of products, and parts will be pin-for-pin
replacements for existing devices, with no change in part nomenclature.
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