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LM317EMP 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
TO-261-4
描述:
LM117 / LM317A / LM317 -N三端可调稳压器 LM117/LM317A/LM317-N 3-Terminal Adjustable Regulator
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
功能描述在P1
导航目录
LM317EMP数据手册
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若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN#20160923001
PCN Number:
20160923001
PCN Date:
Oct. 5, 2016
Title:
Add Cu as Alternative Wire Base Metal for Selected Device(s)
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
Jan. 5, 2017
Estimated Sample
Availability:
Date provided at
sample request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of Cu as an additional bond wire option
for selected devices listed in “Product affected” section below. Devices will remain in current
assembly facilities and there will be no other piece part changes:
Pkg Family
Current Wire
Additional Wire
SOT
Au 1.5 mils
Cu, 1.5 mils
QFN
Au, 1.3 mils
Cu, 1.3 mils
SON
Au, 1.3 mils
Cu, 1.3 mils
SOT_a
Au, 0.9 mils
Cu, 0.96 mils
Reason for Change:
Continuity of supply.
1) To align with world technology trends and use wiring with enhanced mechanical and
electrical properties
2) Maximize flexibility within our Assembly/Test production sites.
3) Cu is easier to obtain and stock
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Anticipated impact on Material Declaration
No Impact to the
Material Declaration
Material Declarations or Product Content reports are driven from
production data and will be available following the production
release. Upon production release the revised reports can be
obtained from the TI ECO website.
Changes to product identification resulting from this PCN:
None
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