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LM4951SD/NOPB 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
音频放大器
封装:
WSON-10
描述:
TEXAS INSTRUMENTS LM4951SD/NOPB 音频功率放大器, WSON
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LM4951SD/NOPB数据手册
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LM5018
ZHCSD76F –JANUARY 2012–REVISED DECEMBER 2014
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
(1)
MIN MAX UNIT
V
IN
, UVLO to RTN –0.3 100 V
SW to RTN –1.5 V
IN
+ 0.3 V
SW to RTN (100 ns transient) –5 V
IN
+ 0.3 V
BST to V
CC
100 V
BST to SW 13 V
R
ON
to RTN –0.3 100 V
V
CC
to RTN –0.3 13 V
FB to RTN –0.3 5 V
Lead Temperature
(2)
200 °C
Maximum Junction Temperature
(3)
150 °C
Storage temperature range, T
stg
–55 150 °C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are
conditions under which operation of the device is intended to be functional. For verified specifications and test conditions, see the
Electrical Characteristics. The RTN pin is the GND reference electrically connected to the substrate.
(2) For detailed information on soldering plastic SO PowerPAD package, refer to Absolute Maximum ratings for Soldering (SNOA549).
Maximum solder time not to exceed 4 seconds.
(3) High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C
6.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
(ESD)
Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22- ±750
C101
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
IN
Voltage 7.5 100 V
Operating Junction Temperature
(2)
–40 125 °C
(1) Recommended Operating Conditions are conditions under the device is intended to be functional. For specifications and test conditions,
see Electrical Characteristics .
(2) High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.
6.4 Thermal Information
LM5018
THERMAL METRICS
(1)
NGU DDA UNIT
8 PINS 8 PINS
R
θJA
Junction-to-ambient thermal resistance 41.3 41.1 °C/W
R
θJCbot
Junction-to-case (bottom) thermal resistance 3.2 2.4 °C/W
Ψ
JB
Junction-to-board thermal characteristic parameter 19.2 24.4 °C/W
R
θJB
Junction-to-board thermal resistance 19.1 30.6 °C/W
R
θJCtop
Junction-to-case (top) thermal resistance 34.7 37.3 °C/W
Ψ
JT
Junction-to-top thermal characteristic parameter 0.3 6.7 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953 ).
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