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LMR12007YMK 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DC/DC转换器
封装:
TSOT-23-6
描述:
TEXAS INSTRUMENTS LMR12007YMK 直流-直流开关降压(逐步递减)稳压器, 可调, 3V-18V输入, 1.25V-16V输出, 750mA输出, SOT-6
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LMR12007YMK数据手册
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Texas Instruments Incorporated PCN#20161209000
PCN Number:
20161209000
PCN Date:
Dec. 15, 2016
Title:
BOM changes for Selected Device(s)
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
March 15, 2017
Estimated Sample
Availability:
Date provided at
sample request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Texas Instruments is pleased to announce updated BOM options for the devices in the 2 groups
shown below in the Product affected section. Group #1 devices are being qualified with a new
bond wire option the device in Group #2 is being qualified with a new BOM set:
Group 1 Devices:
Pkg Family
Current Wire
Additional Wire
VSSOP
Au 1.3 mils
Cu, 1.3 mils
SOT
Au 1.3 mils
Cu, 1.3 mils
SOT_a
Au 1.0 mils
Cu, 1.0 mils
Group 2 Device:
Material
Current
Proposed
Wire (mils)
Au, 0.80, 0.90 mils
Cu, 0.96 mils
Lead Frame Thickness
10 mils
6 mils
Mount compound
4042500
4147858
Mold compound
4205694
4211880
Reason for Change:
Continuity of supply.
1) To align with world technology trends and use wiring with enhanced mechanical and
electrical properties
2) Maximize flexibility within our Assembly/Test production sites.
3) Cu is easier to obtain and stock
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Anticipated impact on Material Declaration
No Impact to the
Material Declaration
Material Declarations or Product Content reports are driven from
production data and will be available following the production
release. Upon production release the revised reports can be
obtained from the TI ECO website.
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