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LP339N/NOPB数据手册
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Texas Instruments Incorporated PCN# 20170629002A
PCN Number:
20170629002A
PCN Date:
Aug 21, 2017
Title:
Transfer of select SLM devices from GFAB to FFAB Wafer Fab site
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
Estimated Sample
Availability:
Date provided at
sample request.
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
Part number change
PCN Details
Description of Change:
The purpose of this Rev A PCN is to add additional devices to the product affected
section of this document. Additional devices are shown as bold with a yellow highlight.
This change notification is to announce the transfer of select SLM devices from GFAB to the FFAB
Wafer Fab site for the selected devices listed in the “Product Affected” section.
Current Fab Site
New Fab Site
Current Fab
Site
Process
Wafer
Diameter
New Fab
Site
Process
Wafer
Diameter
GFAB6
SLM
150 mm
FFAB
SLM
200 mm
GFAB8
SLM
200 mm
FFAB
SLM
200 mm
Qual details are provided in the Qual Data Section.
Reason for Change:
GFAB closure
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
Current:
Current Chip
Site
Chip Site Origin Code (20L)
Chip Site Country Code (21L)
Chip Site City
GFAB6
GF6
GBR
Greenock
GFAB8
GF8
GBR
Greenock
New Fab Site:
New Chip Site
Chip Site Origin Code (20L)
Chip Site Country Code (21L)
Chip Site City
FR-BIP-1
TID
DEU
Freising
Sample product shipping label (not actual product label)

LP339N/NOPB 数据手册

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14 页 / 0.26 MByte
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9 页 / 0.46 MByte

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