Datasheet 搜索 > EEPROM芯片 > ST Microelectronics（意法半导体） > M95512-DFDW6TP 数据手册 > M95512-DFDW6TP 其他数据使用手册 1/12 页
器件3D模型￥ 2.471
M95512-DFDW6TP 其他数据使用手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
EEPROM芯片
封装:
TSSOP-8
描述:
电可擦除可编程只读存储器 512Kbit Serial Bus 128kB 10MHz EEProm
Pictures:
3D模型
符号图
焊盘图
引脚图
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页面导航:
标记信息在P1
应用领域在P5P8
型号编号列表在P10
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M95512-DFDW6TP数据手册
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若手册格式错乱，请下载阅览PDF原文件
PRODUCT / PROCESS CHANGE INFORMATION
1. PCI basic data
1.1 Company STMicroelectronics International N.V
1.2 PCI No. CRP/15/9379
1.3 Title of PCI SHIELDING BAG for SHENZHEN 4-layer Pre plated frame SO8 & TSSOP8 REELS AND TUBES
1.4 Product Category SO8N & TSSOP8 assembled with 4-layer Pre plated frame at ST Shenzhen
1.5 Issue date 2015-09-03
2. PCI Team
2.1 Contact supplier
2.1.1 Name ROBERTSON HEATHER
2.1.2 Phone +1 8475853058
2.1.3 Email heather.robertson@st.com
2.2 Change responsibility
2.2.1 Process Owner Patrick LOW
2.1.2 Corporate Quality Manager Veronique LIVACHE
3. Change
3.1 Category 3.2 Type of change 3.3 Manufacturing Location
Materials New Indirect material part number (same
supplier or different supplier): Boxes, trays,
carriers, back grinding tape, wafer mounting
tape, mold tape, …
ST Shenzhen
4. Description of change
Old New
4.1 Description The reels and tubes of the 4-layer Pre plated
frame SO8N & TSSOP8 packages from ST
Shenzhen (China) are packed into the inner
box without shielding bag.
The reels and tubes of the 4-layer Pre plated
frame SO8N & TSSOP8 packages from ST
Shenzhen (China) will be packed with a
shielding bag into the inner box.
4.2 Anticipated Impact on form,fit,
function, quality, reliability or
processability?
- Form: Transparent shielding bag (packing material)
- Fit: N/A
- Function: N/A
5. Reason / motivation for change
5.1 Motivation This shielding bag will protect the product during exposure to uncontrolled environment before
product usage (transportation/storage).
5.2 Customer Benefit QUALITY IMPROVEMENT
6. Marking of parts / traceability of change
6.1 Description -
7. Timing / schedule
7.1 Date of qualification results 2015-08-21
7.2 Intended start of delivery 2015-09-15
7.3 Qualification sample available? Upon Request
8. Qualification / Validation
8.1 Description QRMMY1513_external_rev1x.pdf
8.2 Qualification report and
qualification results
Available (see attachment) Issue
Date
2015-09-03
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