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MBR20200CTG 其他数据使用手册 - ON Semiconductor（安森美）
制造商:
ON Semiconductor（安森美）
分类:
肖特基二极管
封装:
TO-220-3
描述:
ON SEMICONDUCTOR MBR20200CTG 肖特基整流器, 双共阴极, 200 V, 10 A, TO-220AB, 3 引脚, 1 V
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MBR20200CTG数据手册
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若手册格式错乱，请下载阅览PDF原文件
Final Product/Process Change Notification
Document #:FPCN22647XW1
Issue Date:14 May 2020
TEM001793 Rev. C Page 1 of 7
Title of Change:
Update Notification of FPCN22647XW: EMC change from Samsung SI7200DX2 to Sumitomo EME-
E500HA for rectifier products in Tongfu Microelectronics Co., Ltd, China (TFME) with new Proposed
First Ship Date.
Proposed First Ship date:
01 Jun 2020 or earlier if approved by customer
Contact Information:
Contact your local ON Semiconductor Sales Office or norsahida.sahman@onsemi.com
PCN Samples Contact:
Contact your local ON Semiconductor Sales Office or PCN.samples@onsemi.com
Sample requests are to be submitted no later than 30 days from the date of first notification, Initial
PCN or Final PCN, for this change.
Samples delivery timing will be subject to request date, sample quantity and special customer
packing/label requirements.
Additional Reliability Data:
Contact your local ON Semiconductor Sales Office or Lalan.Ortega@onsemi.com
Type of Notification:
This is a Final Product/Process Change Notification (FPCN) sent to customers. FPCNs are issued 90
days prior to implementation of the change.
ON Semiconductor will consider this change accepted, unless an inquiry is made in writing within
30 days of delivery of this notice. To do so, contact PCN.Support@onsemi.com
Marking of Parts/ Traceability of
Change:
No change in marking
Change Category:
Assembly Change
Change Sub-Category(s):
Material Change
Sites Affected:
ON Semiconductor Sites
External Foundry/Subcon Sites
None
Tongfu Microelectronics Co., Ltd., China
Description and Purpose:
ON Semiconductor wishes to inform to all of our customers of a change in the mold compound used for the devices listed in this PCN for rectifier
products manufactured in our subcontractor factory, TFME. This is the final product change notification (FPCN) of IPCN22647.
This change is a result of an End of Life notification received from Samsung for several of their SDI Mold Compounds. Due to the discontinuance
of the SDI mold compounds, ON Semiconductor will only have limited supplies of the existing material and in some cases this may not allow for the
normal change notification period.
All other aspects of the impacted products (form, fit, function) will remain unchanged.
This Notification must be re-issued with an earlier implementation date due to projected shortages of the current supply of the impacted mold
compound. Our current supplier was unable to sufficiently serve our demand during this end of life process. We hope this does not cause any
inconveniences.
Before Change Description
After Change Description
Mold compound
(TO-262 Package)
Samsung SI7200DX2
Sumitomo EME-E500HA
There is no product marking change as a result of this change.
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