Datasheet 搜索 > 微控制器 > NXP（恩智浦） > MC9S08LL16CLH 数据手册 > MC9S08LL16CLH 产品修订记录 1/7 页
器件3D模型￥ 10.615
MC9S08LL16CLH 产品修订记录 - NXP（恩智浦）
制造商:
NXP（恩智浦）
分类:
微控制器
封装:
LQFP-64
描述:
NXP MC9S08LL16CLH 芯片, 8位微控制器, 16K闪存, 64LQFP
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MC9S08LL16CLH数据手册
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Customer Information Notification
201607003I
Issue Date: 09-Nov-2016
Effective Date: 09-Dec-2016
Here's your personalized quality information
concerning products Digi-Key purchased from NXP.
For detailed information we invite you to view this
notification online
Management Summary
NXP Semiconductors announces an assembly backend process flow change on xQFP / SOIC / TSSOP
packages at NXP-ATTJ assembly site, Tianjin, China.
Change Category
[ ] Wafer Fab
Process
[X] Assembly
Process
[ ] Product Marking
[ ] Test
Location
[ ] Design
[ ] Wafer Fab
Materials
[ ] Assembly
Materials
[ ] Mechanical Specification
[ ]Test Process
[ ] Errata
[ ] Wafer Fab
Location
[ ] Assembly
Location
[ ]
Packing/Shipping/Labeling
[ ] Test
Equipment
[ ] Electrical spec./Test
coverage
Assembly Backend Process Flow Change at ATTJ on xQFP / SOIC /
TSSOP Packages
Information Notification
NXP Semiconductors announces an assembly backend process flow change on xQFP / SOIC / TSSOP
packages at NXP-ATTJ assembly site, Tianjin, China. Process sequence change only for Plating and Dam-
bar cutting operations. Change results in an observable visual difference with Dam-bar cut area now plated.
Current assembly backend process flow sequence:
Molding -> Marking -> PMC(Post Mold Cure) -> Plating -> Dam-bar cutting -> Forming & Separation -> FVI
(Final Visual Inspection)
Proposed assembly backend process flow sequence:
Molding -> Marking -> PMC(Post Mold Cure) -> Dam-bar cutting -> Plating ->Forming & Separation -> FVI
(Final Visual Inspection)
Why do we issue this Information Notification
The assembly backend process flow change can reduce compound particles induced during dam-bar
cutting.
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