Datasheet 搜索 > DA转换器 > Microchip(微芯) > MCP4921T-E/MC 数据手册 > MCP4921T-E/MC 其他数据使用手册 1/11 页


¥ 14.476
MCP4921T-E/MC 其他数据使用手册 - Microchip(微芯)
制造商:
Microchip(微芯)
分类:
DA转换器
封装:
DFN-8
描述:
8月10日/ 12-位电压输出数位类比转换器,SPI接口 8/10/12-Bit Voltage Output Digital-to-Analog Converter with SPI Interface
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P3P4P5P6P7P8P9P10P11
导航目录
MCP4921T-E/MC数据手册
Page:
of 11 Go
若手册格式错乱,请下载阅览PDF原文件

Date:
05 Aug 2017
Product Category:
Memory; Power Management - PWM Controllers; Sigma - Delta A/D Converters; Digital
Potentiometers; System D/A Converters; Instrumentation Amplifier; Battery Management and
Fuel Gauges - Battery Chargers; Temperature Sensors; 8-bit PIC Microcontrollers
Notification subject:
CCB 3041 Initial Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond in
selected products of the 160K wafer technology available in 8L DFN package at NSEB assembly
site
Notification text:
PCN Status:
Initial notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond in selected products of the 160K wafer
technology available in 8L DFN package at NSEB assembly site
Pre Change:
Using gold (Au) bond wire, 8200T or 8600 die attach material, G770HCD or G700LTD molding compound material
and C194 or EFTEC-64T lead frame material
Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire 8600 die attach material, G700LTD molding
compound material and C194 lead frame material
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site NSEB Assembly Site NSEB Assembly Site
Wire material Au Wire CuPdAu Wire
Die attach material 8200T 8600 8600 8600
Molding compound material G770HCD G700LTD G700LTD G700LTD
Lead frame material C194 C194 EFTEC-64T C194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.
Change Implementation Status:
In Progress
Estimated Qualification Completion Date:
January 2018
Product Change Notification - KSRA-20OSOQ751
Page 1 of 2Product Change Notification - KSR
A
-20OSOQ751 - 05 Aug 2017 - CCB 3041 Initial Not...
8
/
7
/
201
7
http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=KSR
A
-20OSOQ7
5
...
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册,每天更新 5,000 多个 PDF 文件