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Final Product/Process Change Notification
Document #:FPCN23279X
Issue Date:15 May 2020
TEM001793 Rev. C Page 1 of 4
TitleofChange:
CapacityexpansionofAssemblyandTestoperationsofformerFairchildSOT23Transistorand
DiodetoONSemiconductorLeshan,China,waferfabchangefromPhenetic,JapantoONISMF
MalaysiaandONNiigata,Japan,wirechangefromAu/CuwiretoAu/Cu/PCCwire
ProposedFirstShipdate:
22Aug2020orearlierifapprovedbycustomer
ContactInformation:
ContactyourlocalONSemiconductorSalesOfficeorAndy.Tao@onsemi.com
PCNSamplesContact:
ContactyourlocalONSemiconductorSalesOfficeor<PCN.samples@onsemi.com>.
Samplerequestsaretobesubmittednolaterthan30daysfromthedateoffirstnotification,
InitialPCNorFinalPCN,forthischange.
Samplesdeliverytimingwillbesubjecttorequestdate,samplequantityandspecialcustomer
packing/labelrequirements.
AdditionalReliabilityData:
ContactyourlocalONSemiconductorSalesOfficeorDustin.Tenney@onsemi.com
TypeofNotification:
ThisisaFinalProduct/ProcessChangeNotification(FPCN)senttocustomers.FPCNsareissued90
dayspriortoimplementationofthechange.
ONSemiconductorwillconsiderthischangeaccepted,unlessaninquiryismadeinwritingwithin
30daysofdeliveryofthisnotice.Todoso,contactPCN.Support@onsemi.com
MarkingofParts/Traceabilityof
Change:
CustomermayreceivethepartsfromONSemiconductorLeshan,ChinafrommonthofSep2020
onwardsonceFPCNexpire.PartsfromONSemiconductorLeshan,Chinacanbeidentifiedthrough
productmarkingwhichfollowONSemiconductormarkingformat.
ChangeCategory:
WaferFabChange,AssemblyChange,TestChange
ChangeSub‐Category(s):
ManufacturingSiteTransfer,MaterialChange
SitesAffected:
ONSemiconductorSites ExternalFoundry/SubconSites
LeshanPhoenixSemiconductor,China AUKDalian
ONSemiconductorCebu,Philippines JCET,China
ONSemiconductorNiigata,Japan PhenitecSemiconductor,Japan
ONSemiconductorSeremban,Malaysia
DescriptionandPurpose:
ThisFinalNotificationannouncestocustomersofitsplansto:
Transfer Assembly and Test operations sites of formerly FairchildSOT23packagefromexistingexternalmanufacturingfacilityto existing
internalmanufacturingsiteONSemiconductorLeshan,China.
TransferWaferFABfromPheniticJapantoONISMF,MalaysiaandONNiigata,Japan,
BackmetalchangefromTiNiAgSnBackmetaltoAubackmetal
SmallSignalDiodes,SmallSignalTransistorswillbeconvertedfromGoldwiretoCopperwireorPd‐CoatedCopperwire(PCCwire)aspartof
theprocessStandardizationinONSemiconductorLeshan,China.ExactBOMbeforeandafterwillbemadeavailabletothecustomercaseby
case.
MoldcompoundchangefromPanasonicCK5000A/EdaleELER‐8100HFE/SumitomoG600FBtoHysolGR640HV

MMBD4148SE 数据手册

ON Semiconductor(安森美)
6 页 / 0.21 MByte
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