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MMBT5551-7-F 其他数据使用手册 - Multicomp

制造商:

Multicomp

分类:

双极性晶体管

封装:

SOT-23

Pictures:

3D模型

符号图

焊盘图

引脚图

产品图

页面导航:

封装尺寸在P3

焊盘布局在P3

电气规格在P1

导航目录

封装尺寸在P3
焊盘布局在P3
电气规格在P1

MMBT5551-7-F数据手册

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www.element14.com

www.farnell.com

www.newark.com

Page <3>

V1.011/09/14

NPN General Purpose Transistor

Package Outline

Plastic surface mounted package

SOT-23

Dim. Min. Max.

A 2.85 2.95

B 1.25 1.35

C 1 Typical

D 0.37 0.43

E 0.35 0.48

G 1.85 1.95

H 0.02 0.1

J 0.1 Typical

K 2.35 2.45

All Dimensions in mm

Important Notice : This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted

for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change

without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any

error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any

assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the

Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence.

Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012.

Part Number Table

Description Part Number

Transistor, Bipolar, NPN, 160V, 600mA, SOT-23 MMBT5551-7-F

Soldering Footprint

Dimensions : Millimetres