Datasheet 搜索 > 压力传感器 > NXP（恩智浦） > MP3H6115AC6U 数据手册 > MP3H6115AC6U 其他数据使用手册 6/12 页
器件3D模型￥ 0
MP3H6115AC6U 其他数据使用手册 - NXP（恩智浦）
制造商:
NXP（恩智浦）
分类:
压力传感器
封装:
SSOP-8
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
MP3H6115AC6U数据手册
Page:
of 12 Go
若手册格式错乱，请下载阅览PDF原文件
Sensors
6 Freescale Semiconductor
MP3H6115A
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Figure 5. SSOP Footprint (Case 1317 and 1317A)
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
0.387
9.83
0.150
3.81
0.050
1.27
TYP
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
