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MURS110T3G 产品修订记录 - ON Semiconductor（安森美）
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MURS110T3G数据手册
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TEM001790 Rev. B Page 1 of 4
Initial Product/Process Change Notification
Document # : IPCN22541X
Issue Date: 22March2019
TitleofChange:
QualificationofHighDensityLeadframe from6rowsto16rowsandBOMChangeforSMBPackageinSub‐
ContractorFactorySeeful
ProposedFirstShipdate:
22September2019orearlieruponcustomerapproval
ContactInformation:
ContactyourlocalONSemiconductorSalesOfficeor<norsahida.sahman@onsemi.com>
Samples:
Samplesshouldbeavailableaftercompletionofqualification.
ContactyourlocalONSemiconductorSalesOfficeor<PCN.Samples@onsemi.com>
Samplerequestsaretobesubmittednolaterthan30daysfromthedateoffirstnotification,InitialPCNor
FinalPCN,forthischange.
TypeofNotification:
This is an Initial Product/Process Change Notification (IPCN) sent to customers. An IPCN is an advance
notificationaboutanupcomingchangeandcontainsgeneralinformationregardingthechangedetailsand
devicesaffected.Italsocontainsthepreliminaryreliabilityqualificationplan.
ThecompletedqualificationandcharacterizationdatawillbeincludedintheFinalProduct/ProcessChange
Notification (FPCN). ThisIPCN notificationwillbefollowed bya Final Product/Process Change Notification
(FPCN) at least 90 days prior to implementation of the change. In case of questions, contact
<PCN.Support@onsemi.com>
ChangePartIdentification:
Affectedproductswillbeidentifiedbydatecode.
ChangeCategory:
WaferFabChange
Assembl yChange TestChange Other
____________
ChangeSub‐Category(s):
ManufacturingSiteAddi tion
Manufacturi ngSite Transfer
Manufacturi ngProcessChange
MaterialChange
Productspecificchange
Datasheet/ProductDocchange
Shi pping/Packaging/Marking
Other:
__________________
SitesAffected:
ONSemiconductorSites:
None
ExternalFoundry/SubconSites:
ShanghaiSeeful
DescriptionandPurpose:
Thisis theinitial notificationannouncing that ONSemiconductor subcontractor factory(Shanghai Seeful) isqualifyinghigh density leadframe
from6‐rowsto16‐rowsincludingBOMchangeasshowninbelowtable.Earlystudyshowsdeviceperformanceandreliabilityisnoteffected.This
changewillallowOnSemiconductortomeetincreasingdemandforourSMBdeviceproducts.
BeforeChangeDescription AfterChangeDescription
LeadFrame 6‐rowsleadframewithC194material 16‐rowsleadframewithC19210material
Clip 6‐rowsclip 16‐rowsclipanddesignchange
MoldCompound KL‐G100S EK1700GS
Carriertape Widertolerance
NewdesignbasedonJEDECspec,narrow
tolerancetoavoidpartmovingincarrierpocket
Thereisnoproductmarkingchangeasaresultofthischange.
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