Datasheet 搜索 > 时钟缓冲器、驱动器、锁相环 > ON Semiconductor（安森美） > NBSG11MNR2G 数据手册 > NBSG11MNR2G 产品修订记录 1/5 页
器件3D模型￥ 40.328
NBSG11MNR2G 产品修订记录 - ON Semiconductor（安森美）
制造商:
ON Semiconductor（安森美）
分类:
时钟缓冲器、驱动器、锁相环
封装:
QFN-16
描述:
2.5V / 3.3V SiGe半导体1 ： 2差分时钟驱动器，带有RSECL输出 2.5V/3.3V SiGe 1:2 Differential Clock Driver with RSECL Outputs
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
标记信息在P1
封装信息在P1
型号编号列表在P3
导航目录
NBSG11MNR2G数据手册
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of 5 Go
若手册格式错乱，请下载阅览PDF原文件
TEM001092 Rev. E Page 1 of 5
Final Product/Process Change Notification
Document # : FPCN20948X
Issue Date: 10 July 2015
Title of Change:
Lead finish and BOM change for for DFN/QFN 2x2 and 3x3 Products assembled at Seremban, Malaysia
Proposed first ship date:
17 October 2015
Contact information:
Contact your local ON Semiconductor Sales Office or <alan.garlington@onsemi.com>
Samples:
Contact your local ON Semiconductor Sales Office or <KokInn.Hoo@onsemi.com>
Additional Reliability Data:
Contact your local ON Semiconductor Sales Office or <KokInn.Hoo@onsemi.com>
Type of notification:
This is a Final Product/Process Change Notification (FPCN) sent to customers. FPCNs are issued 90 days prior
to implementation of the change.
ON Semiconductor will consider this change accepted, unless an inquiry is made in writing within 30 days of
delivery of this notice. To do so, contact <PCN.Support@onsemi.com>.
Change Part Identification:
Parts will have date code on or after WW34 – 2015.
Change category:
Wafer Fab Change Assembly Change Test Change Other
Change Sub-Category(s):
Manufacturing Site Change/Addition
Manufacturing Process Change
Material Change
Product specific change
Datasheet/Product Doc change
Shipping/Packaging/Marking
Other: _______________________
Sites Affected:
All site(s) not applicable
ON Semiconductor site(s) :
ON Seremban, Malaysia
External Foundry/Subcon site(s)
Description and Purpose:
Qualification has been completed for the conversion of the DFN/QFN 2x2 and 3x3 package to use a new Lead frame using a PPF lead finish
along with a new die attach epoxy and mold compound. The purpose is to improve package reliability through improved moisture resistance
and package delamination performance. The lead frame is changing from a Matte Tin lead finish to a PPF finish consisting of Ni-Pd-Au. All
new materials have been fully qualified for use in this package.
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