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NCP2809BDMR2G
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NCP2809BDMR2G数据手册
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UDFN10 3x3, 0.5P
CASE 506AT-01
ISSUE A
DATE 29 JUN 2007
ÍÍÍ
ÍÍÍ
ÍÍÍ
ÍÍÍ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
C
A
SEATING
PLANE
D
B
E
0.15 C
A3
A
A1
2X
2X
0.15 C
SCALE 2:1
DIM
A
MIN NOM MAX
MILLIMETERS
0.45 0.50 0.55
A1 0.00 0.03 0.05
A3 0.127 REF
b 0.18 0.25 0.30
D 3.00 BSC
D2 2.40 2.50 2.60
E 3.00 BSC
1.70 1.80 1.90
E2
e 0.50 BSC
0.19 TYP
K
PIN ONE
REFERENCE
0.08 C
0.10 C
10X
A0.10 C
NOTE 3
L
e
D2
E2
b
B
5
6
10X
1
K 10
10X
10X
0.05 C
8X
0.30 0.40 0.50
L
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.1746
2.6016
1.8508
0.5000 PITCH
0.5651
10X
3.3048
0.3008
10X
DIMENSIONS: MILLIMETERS
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb-Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb-Free indicator, “G” or microdot “ G ”,
may or may not be present.
GENERIC
MARKING DIAGRAM*
XXXXX
XXXXX
ALYWG
G
TOP VIEW
SIDE VIEW
BOTTOM VIEW
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 - Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98AON21330D
ON SEMICONDUCTOR STANDARD
UDFN10 3X3, 0.5P
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2

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