Datasheet 搜索 > 稳压芯片 > ON Semiconductor（安森美） > NCV7805ABD2TR4G 数据手册 > NCV7805ABD2TR4G 产品设计图 1/2 页
￥ 2.686
NCV7805ABD2TR4G 产品设计图 - ON Semiconductor（安森美）
制造商:
ON Semiconductor（安森美）
分类:
稳压芯片
封装:
TO-263-3
描述:
NCV7800 系列 5 V 1 A 表面贴装 正电压 稳压器 - D2PAK-3
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P1
焊盘布局在P1P2
标记信息在P1
导航目录
NCV7805ABD2TR4G数据手册
Page:
of 2 Go
若手册格式错乱，请下载阅览PDF原文件
SCALE 1:1
D
2
PAK
CASE 936−03
ISSUE E
DATE 29 SEP 2015
0
V
U
TERMINAL 4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCHES.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
6. SINGLE GAUGE DESIGN WILL BE SHIPPED
AFTER FPCN EXPIRATION IN OCTOBER 2011.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
0.386 0.403 9.804 10.236
INCHES
B 0.356 0.368 9.042 9.347
C 0.170 0.180 4.318 4.572
D 0.026 0.036 0.660 0.914
E 0.045 0.055 1.143 1.397
F 0.051 REF 1.295 REF
G 0.100 BSC 2.540 BSC
H 0.539 0.579 13.691 14.707
J 0.125 MAX 3.175 MAX
K 0.050 REF 1.270 REF
L 0.000 0.010 0.000 0.254
M 0.088 0.102 2.235 2.591
N 0.018 0.026 0.457 0.660
P 0.058 0.078 1.473 1.981
R
S 0.116 REF 2.946 REF
U 0.200 MIN 5.080 MIN
V 0.250 MIN 6.350 MIN
_
A
12 3
K
F
B
J
S
H
D
M
0.010 (0.254) T
E
OPTIONAL
CHAMFER
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8.380
5.080
DIMENSIONS: MILLIMETERS
PITCH
2X
16.155
1.016
2X
10.490
3.504
XXXXXXG
ALYWW
GENERIC
MARKING DIAGRAM*
XXXXXX = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
WW = Work Week
G = Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
BOTTOM VIEW
OPTIONAL CONSTRUCTIONS
TOP VIEW
SIDE VIEW
DUAL GAUGE
BOTTOM VIEW
L
T
P
R
DETAIL C
SEATING
PLANE
2X
G
N
M
CONSTRUCTION
D
C
DETAIL C
E
OPTIONAL
CHAMFER
SIDE VIEW
SINGLE GAUGE
CONSTRUCTION
S
C
DETAIL C
TT
D
E 0.018 0.026 0.457 0.660
S
8
_
0
_
8
_
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98ASH01005A
ON SEMICONDUCTOR STANDARD
D
2
PAK
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
