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TEM001094 Rev. E Page 1 of 5
Product Bulletin
Document # : PB21446X
Issue Date: 16 September 2016
Title of Change:
Update flat lead length (L) and lead thickness (C) dimensions of SOT23 (TO-236) package in datasheets.
Effective date:
16 September 2016
Contact information:
Contact your local ON Semiconductor Sales Office or <Michael.You@onsemi.com>
Type of notification:
ON Semiconductor will consider this change accepted.
Change category:
Wafer Fab Change Assembly Change Test Change Other Datasheet Change
Change Sub-Category(s):
Manufacturing Site Change/Addition
Manufacturing Process Change
Material Change
Product specific change
Datasheet/Product Doc change
Shipping/Packaging/Marking
Other: _______________________
Sites Affected:
All site(s) not applicable
ON Semiconductor site(s) :
External Foundry/Subcon site(s)
Description and Purpose:
Updated flat lead length (L) and lead thickness (c) dimensions in datasheets to align with actual dimensions. Corrected the conversion error
between millimeters and inches.
There is no change to the form, fit, or function of the physical part.
Previous Table New Table
DIM MIN NOM MAX MIN NOM
MAX
A 0.890 1.000 1.110 0.035 0.040 0.044
A1
0.010 0.060 0.100 0.001 0.002 0.004
b 0.370 0.440 0.500 0.015 0.018
0.020
c 0.090 0.130 0.180 0.003 0.005 0.007
D 2.800 2.900
3.040 0.110 0.114 0.120
E 1.200 1.300 1.400 0.047 0.051 0.055
e
1.780 1.900 2.040 0.070 0.075 0.081
L 0.100 0.200 0.300 0.004 0.008 0.012
L1 0.350 0.540 0.690 0.014 0.021 0.029
H
E
2.100 2.400 2.640 0.083 0.094 0.104
θ
0° ---
10° 0° --- 10°
INCHES
MILLIMETERS
DIM
MIN NOM MAX MIN NOM MAX
A 0.89 1.00 1.11 0.035 0.039 0.044
A1 0.01 0.06 0.10 0.000 0.002 0.004
b 0.37 0.44 0.50 0.015 0.017 0.020
c 0.08 0.14 0.20 0.003 0.006 0.008
D 2.80 2.90 3.04 0.110 0.114 0.120
E 1.20 1.30 1.40 0.047 0.051 0.055
e
1.78 1.90 2.04 0.070 0.075 0.080
L 0.30 0.43 0.55 0.012 0.017 0.022
L1 0.35 0.54 0.69 0.014 0.021 0.027
H
E
2.10 2.40 2.64 0.083 0.094
0.104
θ
0° --- 10° 0° --- 10°
MILLIMETERS
INCHES

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