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OPA2364IDR
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OPA2364IDR数据手册
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Texas Instruments, Inc. PCN# 20150310002
PCN Number:
PCN20150310002
PCN Date:
03/13/2015
Title:
Qualification of Vanguard Facility as an additional FAB site source for selected devices
in the 0.60UM process
Customer Contact:
PCN Manager
Quality Services
*Proposed 1
st
Ship Date:
06/13/2015
Estimated Sample Availability:
Date provided at
sample request
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
Part number change
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of its Vanguard fabrication facility as
an additional wafer FAB source for the selected devices listed in "Product Affected" section.
Currently Qualified Sites, Process, wafer dia.
Additional Site, Process, wafer dia.
TMSC-WF2, 0.60UM, 200mm
Vanguard, VIS 0.6UM DPDM, 200mm
The 0.6um DPDM process has been running in production successfully in Vanguard since 2006.
Qualification details are provided in the Qual Data Section.
Reason for Change:
Continuity of Supply
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
Current
Chip Site
Chip site code (20L)
Chip country code (21L)
TSMC-WF2
TS2
TWN
New
Chip Site
Chip site code (20L)
Chip country code (21L)
Vanguard (VIS)
VAN
TWN
Sample product shipping label (not actual product label)

OPA2364IDR 数据手册

TI(德州仪器)
40 页 / 1.58 MByte
TI(德州仪器)
3 页 / 0.23 MByte

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