Datasheet 搜索 > 微控制器 > Microchip（微芯） > PIC16C55A-04/P 数据手册 > PIC16C55A-04/P 产品描述及参数 1/18 页
器件3D模型￥ 22.967
PIC16C55A-04/P 产品描述及参数 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
PDIP-28
描述:
PIC16C5x 8 位微控制器Microchip 的 PIC16C 系列微控制器 8 位 CMOS MCU，将 Microchip 的 PIC® 体系架构融入到引脚和封装选件中，从节省空间的 14 引脚设备到功能丰富的 64 引脚设备。 现在由基于闪存的型号代替，这些设备在传统设计方面也仍受到欢迎。 对于新应用，应考虑 PIC16F 型号。 PIC16C5x 系列微控制器基于 Microchip 基线体系结构，带 2 层硬件堆栈和 33 个 12 位指令。 这些 MCU 提供高达 10 MIPS、3 字节程序内存和高达 73 字节 RAM 的数据存储器。 板载是一个 RC 振荡器，精确度为 ±1%。### 特点33 个指令 2 级硬件堆栈 除 PIC16C55/C55A/C57/C57C/CR57C 之外的所有型号上均有 12 个输入/输出引脚 20 个输入/输出引脚 – PIC16C55/C55A/C57/C57C/CR57C 一个 8 位计时器 监控计时器 (WDT) 通电重置 (POR) 设备重置计时器 (DRT) ### PIC16 微控制器
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
应用领域在P3
导航目录
PIC16C55A-04/P数据手册
Page:
of 18 Go
若手册格式错乱，请下载阅览PDF原文件
© 2007 Microchip Technology Inc. DS51140N-page 1
CONTENTS
1.0 Introduction ......................................................... 1
2.0 MPLAB ICE 2000 System................................... 1
3.0 Emulator-Related Issues .................................... 2
4.0 Processor Modules ............................................. 2
5.0 Device Adapters ................................................. 4
6.0 Device Adapter Target Footprints ....................... 9
1.0 INTRODUCTION
The processor modules for MPLAB
®
ICE 2000 are
interchangeable personality modules that allow
MPLAB ICE 2000 to be reconfigured for emulation of
different PIC
®
microcontrollers (MCUs). This modular-
ity allows the emulation of many different devices with
the addition of a processor module and device adapter,
which provides a very cost effective multiprocessor
emulation system.
The device adapters for MPLAB ICE 2000 are inter-
changeable assemblies that allow the emulator system
to interface to a target application system. Device
adapters also have control logic that allows the target
application to provide a clock source and power to the
processor module. The device adapters support PIC
MCUs in DIP, SDIP and PLCC packages.
Transition sockets, used along with a device adapter,
provide a method of accommodating all PIC MCU
packages, including SOIC, SSOP, PQFP and TQFP
packages.
2.0 MPLAB ICE 2000 SYSTEM
A brief overview of the different components of the
system is shown in the figure below. Each component
is discussed in the following subsections.
FIGURE 2-1: MPLAB
®
ICE 2000
EMULATOR SYSTEM
2.1 Host to Pod Cable
This is a standard parallel interface cable. MPLAB ICE
2000 is tested with a 6-foot cable. A longer cable may
work, but is not ensured. The cable connects to a par-
allel port on the PC. If a PC has a printer connected to
an LPT device, it is recommended that an additional
interface card be installed, rather than using a splitter
or an A/B switch.
2.2 Emulator Pod
The Emulator Pod contains emulator memory and
control logic. MPLAB ICE 2000 contains a main board
and an additional board for expanded trace memory
and complex control logic. There are no field service-
able parts in the pod. For more information on the pod,
see the MPLAB ICE 2000 on-line help file in MPLAB
IDE (Help>Topics
) or the “MPLAB
®
ICE 2000
In-Circuit Emulator User’s Guide” (DS51488).
The MPLAB ICE 2000 processor module is inserted
into the pod for operation.
2.3 Processor Module
The processor module contains the emulator chip, logic
and low-voltage circuitry. There are no field-serviceable
parts mounted on the printed circuit board housed
within the processor module enclosure.
Communications Cable
Power Supply
Cable
Emulator Pod
Processor Module
with Cable
Logic Probe
Connector
Device Adapter
Transition Socket
Processor Module and Device Adapter Specification
MPLAB
®
ICE 2000
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
