Datasheet 搜索 > 微控制器 > Microchip（微芯） > PIC18F4685-E/ML 数据手册 > PIC18F4685-E/ML 其他数据使用手册 1/8 页
器件3D模型￥ 34.818
PIC18F4685-E/ML 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-44
描述:
PIC18 系列 3328 B RAM 96 kB 闪存 8位 微控制器 - QFN-44
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
应用领域在P1P3
型号编号列表在P4P5P6P7P8
导航目录
PIC18F4685-E/ML数据手册
Page:
of 8 Go
若手册格式错乱，请下载阅览PDF原文件
Search ...
PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT
US CONTACT US myMicrochip Login
|| || |
||
Date:
17 Oct 2016
Product Category:
8-bit Microcontrollers; 16-bit Microcontrollers and Digital Signal Controllers
Notification subject:
CCB 2697 Final Notice: Qualification of CuPdAu bond wire in selected products of the 150K and
160K wafer technologies available in 44L QFN (8x8x0.9mm) package at MTAI assembly site.
Notification text:
PCN Status:
Final notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 150K and
160K wafer technologies available in 44L QFN (8x8x0.9mm) package at MTAI assembly site.
Pre Change:
Using gold (Au) bond wire
Post Change:
Using gold (Au) bond wire or palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site MTAI assembly site MTAI assembly site
Wire material Au wire Au wire or CuPdAu wire
Die attach material 3280 3280
Molding compound material G700LTD G700LTD
Lead frame material C194 C194
Product Change Notification - JAON-14OICS710
Page 1 of 3Product Change Notification - JAON-14OICS710 - 17 Oct 2016 - CCB 2697 Final Notic
e
...
10
/
18
/
201
6
http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON-14OICS
7
...
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
