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器件3D模型￥ 10.144
PIC24FV32KA304T-I/ML 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
16位微控制器
封装:
QFN-44
描述:
PIC 32MHz 闪存：11K@x24bit
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P4
导航目录
PIC24FV32KA304T-I/ML数据手册
Page:
of 21 Go
若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - LIAL-02YNJF503
Date:
08 May 2018
Product Category:
8-bit PIC Microcontrollers; 16-Bit - Microcontrollers and Digital Signal Controllers; USB Power
Delivery; Capacitive Touch Sensors; USB Bridge
Affected CPNs:
Notification subject:
CCB 3220,3220.001-3220.008 Final Notice: Qualification of MMT as an additional assembly site
for selected products of 200K wafer technology available in 64L, 44L, 28L, 20L, and 16L QFN
packages
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of MMT as an additional assembly site for selected products of 200K wafer
technology available in 64L QFN (9x9mm) ,44L QFN (8x8mm), 28L QFN (6x6mm and 5x5mm),
28L QFN-S (6x6mm and 5x5mm), 20L QFN (5x5mm and 4x4mm), and 16L QFN (4x4mm and
3x3mm) QFN packages
Pre Change:
Assembled at MTAI assembly site
Post Change:
Assembled at MTAI and MMT assembly site.
Pre and Post Change Summary:
Pre Change
Post Change
Assembly Site
Microchip Technology
Thailand HQ (MTAI).
Microchip
Technology
Thailand HQ
(MTAI)
Microchip
Technology
Thailand
Branch (MMT)
Wire material
Au
CuPdAu
Au
CuPdAu
CuPdAu
Die attach material
3280
3280
Molding compound material
G700LTD
G700LTD
Lead frame material
C194
C194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
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